A High Uniformity Readout Integrated Circuit for Infrared Focal Plane Array Applications

Tong Zhou; Tao Dong; Yan Su; Yong He

doi:10.4028/www.scientific.net/AMM.602-605.2632

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 602-605A High Uniformity Readout Integrated Circuit for...

A High Uniformity Readout Integrated Circuit for Infrared Focal Plane Array Applications

Abstract:

Infrared focal plane arrays (IRFPA) suffer from inherent low frequency and fixed patter noise (FPN). To achieve high quality infrared image by mitigating the FPN of IRFPAs, a novel low-noise and high uniformity readout integrated circuit (ROIC) has been proposed. A correlated double sampling (CDS) with single capacitor method has been adopted in the ROIC design which can effectively reduce the FPN, KTC and 1/f noise. A 4×4 experimental readout chip has been designed and fabricated using the SMIC 0.18 μm CMOS process. Both the function and performance of the proposed readout circuit have been verified by experimental results. The test results show that the proposed ROIC has a good performance in practical applications.

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Periodical:

Applied Mechanics and Materials (Volumes 602-605)

Pages:

2632-2636

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.602-605.2632

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Online since:

August 2014

Authors:

Tong Zhou, Tao Dong*, Yan Su, Yong He

Keywords:

Correlated Double Sampling, High Uniformity, Readout Integrated Circuit

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