The Influence of Substrate on the Mechanical and Tribological Characteristics of MEMS Materials for Space Applications

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Aluminum, gold, silver, nickel, silicon, glass, silicon dioxide, silicon nitride and so on, employed as bulk materials or thin films, represent the most commonly used materials for MEMS applications within the automotive, biomedicine, spatial industries and so forth. This work is a study regarding the influence of substrate nature on the mechanical properties of silver thin films elaborated for MEMS devices. The silver thin films were obtained by thermal evaporation method under vacuum protection on three different substrates. Glass, plastic (polycarbonate) and steel (C45) respectively are the materials used for the substrates. Further, atomic force microscopy investigations were performed on the elaborated samples in order to characterize them at a nanoscale and establish substrates influence. The Young’s modulus, nanohardness and roughness of the researched samples are the characteristics that were determined. A significant influence of substrate nature on the properties mentioned above for the studied silver thin films was marked out.

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329-334

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October 2014

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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[1] J.C. Orlianges, A. Pothier, D. Mercier, P. Blondy, C. Champeaux, A. Catherinot, M.I. De Barros, S. Pavant, Application of aluminum oxide and ta-C thin films deposited at room temperature by PLD in RF-MEMS fabrication, Thin Solid Films 482 (2005).

DOI: 10.1016/j.tsf.2004.11.143

Google Scholar

[2] J.E.E. Zekry, D.S. Tezcan, V. Cherman, O.V. Pedreira, B. Wang, H. El Ghannudi, J. P. Celis, R. Puers, C. van Hoof, H.A.C. Tilmans, Design, fabrication and testing of wafer-level thin film vacuum packages for MEMS based on nanoporous alumina membranes. Sens. Actuators A 189 (2013).

DOI: 10.1016/j.sna.2012.09.034

Google Scholar

[3] M. Kim, W.J. Ha, J.W. Anh, H.S. Kim, S.W. Park, D. Lee, Fabrication of nanoporous gold thin films on silicon substrate by multilayer deposition of Au and Ag, J. Alloys Compd. 484 (2009) 28-32.

DOI: 10.1016/j.jallcom.2009.05.067

Google Scholar

[4] S.W. Han, H.W. Lee, H.J. Lee, J.Y. Kim, J.H. Kim, C.S. Oh, S.H. Choa, Mechanical properties of Au thin film for application in MEMS/NENS using microtensile test, Curr. Appl. Phys. 6S1 (2006) e81-e85.

DOI: 10.1016/j.cap.2006.01.017

Google Scholar

[5] V.A. Serban, R.A. Rosu, A.I. Bucur, D.R. Pascu, Deposition of titanium nitride layers by electric arc – Reactive plasma spraying method, Appl. Surf. Sci. 265 (2013) 245-249.

DOI: 10.1016/j.apsusc.2012.10.187

Google Scholar

[6] Y. Zhao, G. Lin, J. Xiao, W. Lang, C. Dong, J. Gong, C. Sun, Synthesis of titanium nitride thin films deposited by a new shielded arc ion plating, Appl. Surf. Sci. 257 (2011) 5694-5697.

DOI: 10.1016/j.apsusc.2011.01.075

Google Scholar

[7] E. Cianci, A. Coppa, V. Foglietti, M. Dispenza, R. Buttiglione, A.M. Fiorello, R. Marcelli, S. Catoni, D. Pochesci, Fabrication of RF-MEMS switches on LTCC substrates using PECVD a-Si as sacrificial layer, Microelectron. Eng. 84 (2007) 1401-1404.

DOI: 10.1016/j.mee.2007.01.096

Google Scholar

[8] G. Guisbiers, M. Wautelet, Materials selection for micro-electromechanical systems, Mater. Des. 28 (2007) 246-248.

DOI: 10.1016/j.matdes.2005.05.012

Google Scholar

[9] J. Fritsch, F.M. Wisser, K. Eckhardt, V. Bon, G. Mondin, B. Schumm, J. Grothe, S. Kaskel, A new molecular silver precursor for the preparation of thin conductive silver films, J. Phys. Chem. Solids 74 (2013) 1546-1552.

DOI: 10.1016/j.jpcs.2013.05.022

Google Scholar

[10] Y.C. Huang, C.H. Yen, H.W. Lin, C.S. Tan, Direct preparation of silver nanoparticles and thin films inCO2-expanded hexane, J. Supercrit. Fluids 89 (2014) 137-142.

DOI: 10.1016/j.supflu.2014.03.003

Google Scholar

[11] Y. Cao, S. Allameh, D. Nankivil, S. Sethiaraj, T. Otiti, W. Soboyejo, Nanoindentation easurements of the mechanical properties of polycrystalline Au and Ag thin films on silicon substrates: Effects of grain size and film thickness, Mater. Sci. Eng., A 427 (2006).

DOI: 10.1016/j.msea.2006.04.080

Google Scholar

[12] Y. Nakanishi, K. Kato, H. Omoto, M. Yonekura, Correlation between microstructure and salt-water durability of Ag thin films deposited by magnetron sputtering, Thin Solid Films 532 (2013) 141-146.

DOI: 10.1016/j.tsf.2012.12.093

Google Scholar

[13] T. Brown, K. Robbie, Observations of self-assembled microscale triangular-shaped spikes in copper and silver thin films, Thin Solid Films 531 (2013) 103-112.

DOI: 10.1016/j.tsf.2012.12.118

Google Scholar

[14] A. Inberg, P. Livshits, Z. Zalevsky, M. Levi, Y. Shacham-Diamand, Silver nanometer-scale thin films by electroless deposition oninsulating surfaces activated by gold nanoparticles, Electrochim. Acta 113 (2013) 792-796.

DOI: 10.1016/j.electacta.2013.05.015

Google Scholar

[15] I.C. Estrada-Raygoza, M. Sotelo-Lerma, R. Ramirez-Bon, Structural and morphological characterization of chemically deposited silver films, J. Phys. Chem. Solids 67 (2006) 782-788.

DOI: 10.1016/j.jpcs.2005.10.183

Google Scholar