Mechanical Characteristics of Electronic Printed Circuit Obtained by the Vapour Phase Soldering Process

Abstract:

The goal of the present paper is to describe some mechanical aspects regarding the adhesion of the copper layer deposit on the rigid support of printed circuit boards (PCB) used in electronic technology. In order to highlight the adhesion of the copper layer in correlation with different rigid support, there were performed some micro-scratch tests using a dedicated system. The mechanical strength is obtained by shear test. The paper novelty presents a mechanical experiment which will describe the tribological properties with influence on the reliability of electronic assemblies

• Periodical: Applied Mechanics and Materials (Volume 658)
• Pages: 71-76
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.658.71
• Online since: October 2014
• Authors: Georgiana Ionela Dumitru, Andrei Tudor*, Georgiana Chisiu, Ioan Plotog
• Keywords: Adhesion, Cooper, Micro-Scratch, Printed Circuit Board (PCB), Tribology

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