Effect of Temperature on the Mechanical Property of the Film-Substrate Interface of Diamond Coatings

Abstract:

Model of the film-substrate interface of diamond coatings is built with the method of molecular dynamic, and the molecular dynamic simulation is applied to study the mechanical property of the model based on the Morse potential function and Tersoff potential function with temperature ranging from 0K to 800K. The results show that the adhesive strength of the interface between the diamond coatings and the cemented carbide substrate behaves a downward trend when the temperature rises from 0K to 800K and the downward trend is sharp when the temperature increases from 0K to 300K and the downward trend is smooth when the temperature rises from 300K to 800K. Meanwhile, the varying trend of the energy with the temperature is similar to the adhesive strength.

• Periodical: Applied Mechanics and Materials (Volumes 670-671)
• Pages: 506-511
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.670-671.506
• Online since: October 2014
• Authors: Xiao Gang Jian*, Yun Hua Zhang
• Keywords: Adhesive Strength, Diamond Coatings, Interface, Molecular Dynamic (MD), Temperature

References

[1] Lv Fanxiu, Song Jianhua, Tang Weizhong, et al. Heat Treatment, 2008, 23(1): 2-11.

[2] Zhao Zhiyan, Deng Fuming, Lu Xuejun, et al. Cemented Carbide, 2009, 26(4): 246-251.

[3] Jian Xiaogang, Chen Ming, Sun Fanghong, Zhang Zhiming. Rare Metal Materials and Engineering, 2004, 33(12): 1329~1333.

[4] Jian Xiaogang, Shi Laide, Chen Ming, Sun Fanghong. Diamond and Related Materials, Vol. 2-3, 2006: 313-316.

[5] A. Morono, S.M. Gonzalez de Vicente, E.R. Hodgson. Fusion Engineering and Design, 2007, 82(15-24): 2563-2566.

[6] W.Z. Lu, D.W. Zuo, M. Wang, et al. Key Engineering Materials, 2006, 315-316: 464-486.

[7] S. Silva, V.P. Mammana, M.C. Salvadori, et al. Diamond and Related Materials, 1999(8): 1913-(1918).

[8] Davies A R, Field J E, Takahashi K, et al. Diamond and Related Materials, 2005, 14: 6-10.

[9] J. Tersoff. PHYSICAL REVIEW, 1987, 37(12): 6992-7000.

[10] N. Juslin, P. Erhart, at al. JOURNAL OF APPLIED PHYSICS, 98, 123520(2005).

[11] X. Gonze, J.M. Beuken, R. Caracas, et al. Comp. Mater. Sci. 25, 478 (2002).

[12] Li Y, Ramesh KT, Chin ESC. Compos Mater, 2007, 41: 27-40.

[13] Liu P, Zhang Y W. Appl Phys Lett, 2009, 94(23): 231912.

[14] Dmitry Bedrov, Grant D. Smith.J. Phys. Chem. B, 1999, 103, 3791-3796.

[15] Quan Weilong, Li Hongxuan, et al. Journal of Chemical Physics, 2010, 59(8), 5687-05.

[16] D.L. Zheng, S.D. Chen, A.K. Soh, et al. Computational Materials Science, 48(2010): 551-555.

[17] S.D. Chen, F.J. Ke, M. Zhou, Y.L. Bai. Acta Mater, 55(2007): 3169–3175.