Fabrication Technology Study of Thermal Isolation Structure on Chip

Xu Ji; Xiang Bo Song; Ming Li; Hai Li Li; Xi Luo

doi:10.4028/www.scientific.net/AMM.703.41

Paper Titles

Copolymerization of Propylene Oxide and Carbon Oxide Catalyzed by Nano SalenCoCl Complex
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Corrosion of High Zn Content Al-Zn-Mg-Cu Alloy in 3.5 wt.% NaCl Solution
p.21

Crystal Structure and Antioxidant Activity of 6-Gingerol Oxime
p.29

Evaluation of Binary System (NaI-Na₃PO₄) Solid Electrolyte and Performance of Sodium Battery
p.33

Fabrication Technology Study of Thermal Isolation Structure on Chip
p.41

Flow Behavior of Composites of PA6/Kaolin Nanoparticles
p.45

Influence of Bi_3.15Nd_0.85Ti₃O₁₂ Buffer Layer on Structure and Electrical Properties of Bi_0.94Ce_0.06Fe_0.97Ti_0.03O₃ Thin Films
p.51

Influence of MnCO₃ Addition on the Grain Refinement of AZ91 Magnesium Alloy
p.56

Influence on the LED Luminous Efficiency from COB Packaging with Different Chip Arrangement
p.60

HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 703Fabrication Technology Study of Thermal Isolation...

Fabrication Technology Study of Thermal Isolation Structure on Chip

Abstract:

This paper proposes to fabricate thermal insulation structure between different regions with different temperature need for maintaining the biochemical reaction on a chip. It will reduce the heat transfer between different temperature regions, and be helpful to realize the temperature control of different regions of the chip. The fabrication experiment of the thermal isolation hole/cavity by PECVD SiC film deposition and the parylene-C film deposition experiment were performed. This kind of heat insulation structures would also ensure the strength of such devices.

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Periodical:

Applied Mechanics and Materials (Volume 703)

Pages:

41-44

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.703.41

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Online since:

December 2014

Authors:

Xu Ji*, Xiang Bo Song, Ming Li, Hai Li Li, Xi Luo

Keywords:

Fabrication Technology, On Chip, Parylene-C, Silicon Carbide (SiC), Thermal Isolation

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* - Corresponding Author

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