Mechanical and Thermal Properties of PCM Wallboards Based on Gypsum and Paraffin

Abstract:

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This paper studied on preparation, mechanical and thermal properties of two PCM wallboards made of gypsum and paraffin composite, PCM particles wallboard and PCM bag packed wallboard. Density, flexural and compressive strength and thermal conductivity of PCM particles wallboards deceased as PCM particles dosage increasing. Only PCM particles wallboard with PCM particles dosage 30% is suitable. Thermal comparison between PCM wallboards and pure gypsum wallboard shows that two PCM wallboards have better thermal properties and PCM wallboards can be used in building envelope to cut down building energy-consumption.

Info:

Periodical:

Edited by:

Dongye Sun, Wen-Pei Sung and Ran Chen

Pages:

3553-3557

DOI:

10.4028/www.scientific.net/AMM.71-78.3553

Citation:

X. P. Wang et al., "Mechanical and Thermal Properties of PCM Wallboards Based on Gypsum and Paraffin", Applied Mechanics and Materials, Vols. 71-78, pp. 3553-3557, 2011

Online since:

July 2011

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Price:

$35.00

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