Effect of Coating on the Thermal Conductivities of Diamond/Cu Composites Prepared by Spark Plasma Sintering (SPS)

Abstract:

The carbide forming is proposed to improve interfacial bonding between diamond particles and copper-matrix for diamond/copper composites. The volume fraction of diamond and minor titanium are optimized. The microstructures, thermal properties, interface reaction production and its effect of minor titanium on the properties of the composites are investigated. The results show that the bonding force and thermal conductivity of the diamond/Cu-Ti alloys composites is much weaker and lower than that of the coated-diamond/Cu. the thermal conductivity of coated-60 vol. % diamond/Cu composites is 618 W/m K which is 80 % of the theoretical prediction value. The high thermal conductivity has been achieved by forming the titanium carbide at diamond/copper interface to gain a good interface.

• Periodical: Applied Mechanics and Materials (Volume 722)
• Pages: 25-29
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.722.25
• Online since: December 2014
• Authors: Q.L. Che*, X.K. Chen, Y.Q. Ji, Y.W. Li, L.X. Wang, S.Z. Cao, Y.G. Jiang, Z. Wang
• Keywords: Diamond Composite, Spark Plasma Sintering, Thermal Conductivity

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