Influence Study of Sheet Resistance Measurement Errors by Square Four Probes

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The article analyses the principle of square four probe measurement technology. The principle of the probe vacillated at testing a large silicon wafer is analyzed, and interference can be avoided while measuring and analyzing the impact on square four probe measurement by probe vacillate. The influence of probe wavering using square four probe method for the equipment designed by authors is analyzed with detailed data, and calculated error of the probe wander. Probe positions of maximum error produced are found, so ensuring testing accuracy schemes are proposed at last.

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125-128

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February 2015

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© 2015 Trans Tech Publications Ltd. All Rights Reserved

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