Fabrication of Ultrathin Free-Standing Ceramic Chips Based on Printing Technology

Wen Wen Kong; Bo Gao; Chun Ping Jiang; Ai Min Chang

doi:10.4028/www.scientific.net/AMM.748.11

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Flexible Pressure Sensor Based on Photo Paper-Molded Micro-Structural AgNWs/PDMS Electrode
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Silver Nanowires Deposited on Grooved Surface as Bendable Resistance Sensor
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Fabrication of Ultrathin Free-Standing Ceramic Chips Based on Printing Technology
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Modeling and Optimizing Industrial Inkjet Printhead for Printable Electronics Fabrication
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Synthesis of Nitro-Functionalized A₃B-Type Tetraphenylporphyrins Compounds and Potential Applications in Dye-Sensitized Solar Cells
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Conductive Improvement of Flexography Printed Silver Pattern by Water Washing
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Dip-Coating of Patterned Organic Semiconductor Films
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Perovskite CH₃NH₃PbI₃ Heterojunction Solar Cells via Ultrasonic Spray Deposition
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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 748Fabrication of Ultrathin Free-Standing Ceramic...

Fabrication of Ultrathin Free-Standing Ceramic Chips Based on Printing Technology

Abstract:

In order to obtain high quality ultrathin free-standing ceramic chips, a new manufacturing process based on the screen printing and the cold isostatic pressing process has been developed.¹⁾ In this process, an ultrathin free-standing green sheet (less than 20 μm thick) can be achieved successfully as shown in Fig. 1. After sintering, an ultrathin free-standing ceramic chip (less than 20 μm thick) with good density uniformity, can be obtained as shown in Fig. 2. In addition, the thicknesses of the ultrathin chips can be adjusted by changing the printing parameters for different application requirements. Such process can significantly widen the scope and applicability of the ultrathin chips in many kinds of materials.

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Periodical:

Applied Mechanics and Materials (Volume 748)

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11-14

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.748.11

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Online since:

April 2015

Authors:

Wen Wen Kong, Bo Gao, Chun Ping Jiang*, Ai Min Chang

Keywords:

Ceramic, Free-Standing, Screen Printing, Ultrathin Chips

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