Effect of Aluminium Addition on Microstructure and Microhardness of Sn-0.7Cu-xAl Lead-Free Solder Alloy

Abstract:

The effect of Al particles addition on the microstructure and microhardness of Sn-0.7Cu-xAl lead-free solder was systematically investigated. The Sn-0.7Cu-xAl solder alloy was successfully fabricated via powder metallurgy (PM) method which consists of mixing, compaction and sintering. Results show that the crystallization of Sn occurs in two different modifications; α-Sn and β-Sn, where the formation of β-Sn able to reinforce the solder matrix. The Al particles also distributed homogeneously along the grain boundaries. The microhardness was improved by 19% as the weight percentage of the Al particles increased up to 1.0 wt.%.

• Periodical: Applied Mechanics and Materials (Volumes 754-755)
• Pages: 166-170
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.754-755.166
• Online since: April 2015
• Authors: Nurul Razliana Abdul Razak*, Nisrin Adli, Norainiza Saud, Sayyidah Amnah Musa
• Keywords: Lead-Free Solder Alloy, Microhardness, Microstructure, Powder metallurgy

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