Further Analysis on Silver Ions Migration

Xin Gong; Chao Duan

doi:10.4028/www.scientific.net/AMM.798.402

Paper Titles

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Application of Oyster (Anadara Inflata) Shell Chitosan as Adsorbent for Heavy Metal Cu(II) Ion
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Wear Behaviour of Cryogenic Treated M2 Tool Steel under Dry Sliding Condition
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Further Analysis on Silver Ions Migration
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The Spontaneous Growth of Pb Whisker from the Pb₆₀Sn₄₀ Solder Layer on the Au Coating
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Environmental Effects on the Static and Fatigue Behaviours of Hemp Fibre under Tensile Loading
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Epoxy Resin as a Binder in the Preparation of Rutile Coated Electrodes
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Research on Wear Mechanism of Solid Lubrication Bearing in Vacuum Environment
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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vol. 798Further Analysis on Silver Ions Migration

Further Analysis on Silver Ions Migration

Abstract:

Silver ions migration can cause short circuit between two conductors with different voltage, and it is the main cause of many catastrophic failures in components. Since silver glue is widely used to adhere chips in the components for its low cost, being able to coated automatically and high thermal conductivity. Research on the mechanisms of silver migration is quite important for taking measures to prevent Ag-migration caused failures. In previous studies four factors has been presented which induce a silver ions migration, they are silver material, electric field, humidity, and contamination, but will it be inevitable when the above factors exist In another word, what should we do to prevent the migration In this paper, we confirm that the above four factors are necessary rather than sufficient for silver migration and present a new influence factor on silver migration through a failure analysis case, which gives an important guidance for the reliability design, evaluation and analysis of a component.

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Periodical:

Applied Mechanics and Materials (Volume 798)

Pages:

402-405

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.798.402

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Online since:

October 2015

Authors:

Xin Gong*, Chao Duan

Keywords:

Failure Analysis, Failure Mechanism, Short, Silver Ions Migration

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