For Libraries For Publication Open Access Downloads About Us Contact Us
Paper Titles
Preparation of Pb(II)-Imprinted-Carboxymethyl Chitosan-Pectin-BADGE Film as Sorbent for Pb(II) Ion
p.384
Application of Oyster (Anadara Inflata) Shell Chitosan as Adsorbent for Heavy Metal Cu(II) Ion
p.390
Wear Behaviour of Cryogenic Treated M2 Tool Steel under Dry Sliding Condition
p.395
Further Analysis on Silver Ions Migration
p.402
The Spontaneous Growth of Pb Whisker from the Pb60Sn40 Solder Layer on the Au Coating
p.406
Environmental Effects on the Static and Fatigue Behaviours of Hemp Fibre under Tensile Loading
p.410
Epoxy Resin as a Binder in the Preparation of Rutile Coated Electrodes
p.419
Research on Wear Mechanism of Solid Lubrication Bearing in Vacuum Environment
p.424
Predicting Mechanical and Thermal Behavior of Multiphase Composite Containing Phase Change Material (PCM) by Micromechanical Approaches
p.430

The Spontaneous Growth of Pb Whisker from the Pb60Sn40 Solder Layer on the Au Coating

Article Preview

Abstract:

In a recent failure analysis case of relay, the pure Pb whisker growth is found on the Pb60Sn40 solder layer on the Au coating of the spring leaf. The content analysis by the EDX shows that the Pb whisker grows from the Pb grain, which is surrounded by the AuSn intermetallic compound. It is thought that the elastic force of the spring leaf and the compressive stress from the intermetallic compound contributes to the Pb whisker growth, and the later factor is confirmed by the FIB (focused ion beam) result. Besides, the statistics result shows that the longer Pb whisker corresponds to the thicker Au coating, which could be explained by the effect of Au: forming AuSn intermetallic compound and Pb rich area. This work enriches our understandings on the metal whisker growth and consequently potential failure mode of SnPb solder.

You might also be interested in these eBooks
Mechanical and Aerospace Engineering VI View Preview

Info:

Periodical:

Applied Mechanics and Materials (Volume 798)

Pages:

406-409

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.798.406

Citation:

Cite this paper

Online since:

October 2015

Authors:

Zhi Bin Wang*, Yan Wei Zhang, Wei Zhang, Yan Chen, Xin Gong, Meng Meng

Keywords:

Failure Analysis, Intermetallic Compound, Pb Whisker

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2015 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

References

[1] M. W. Barsoum, E. N. Hoffman, R. D. Doherty, S. Gupta and A. Zavaliangos: Phys. Rev. Lett. Vol. 93(20) (2004), p.206104.

Google Scholar

[2] Tung-Han Chuang: Script. Mater. Vol. 55(2006), p.983.

Google Scholar

[3] Chi-Chang Hu, Yi-Da Tsai, Chi-Cheng Lin, Gen-Lan Lee, Sinn-Wen Chen, Tai-Chou Lee and Ten-Chin Wen: J. Alloys Compds. Vol. 472(2009), p.121.

Google Scholar

[4] E. Chason, N. Jadhav, W. L. Chan, L. Reinbold and K. S. Kumar: Appl. Phys. Lett. Vol. 92(2008), p.171901.

Google Scholar

[5] C. F. Li, Z. Q. Liu and J. K. Shang: J. Alloys Compds. Vol. 550(2013), p.231.

Google Scholar

[6] H. Ye: J. Alloys Compds. Vol. 509(5) (2011), p. L52.

Google Scholar

[7] F. Pei, N. Jadhav and E. Chason: Appl. Phys. Lett. Vol. 100(2012), p.221902.

Google Scholar

[8] K. S. Kim, S. S. Kim, Y. Yorikado, K. Suganuma, M. Tsujimoto and I. Yanada: J. Alloys Compds. Vol. 558(2013), p.125.

Google Scholar

[9] K. N. Tu and J. C. M. Li: Mater. Sci. Eng. A Vol. 409(2005), p.131.

Google Scholar

[10] S. H. Liu, Chih Chen, P. C. Liu and T. Chou: J. Appl. Phys. Vol. 95(2004), p.7742.

Google Scholar

[11] Jay A. Brusse, Gary J. Ewell and Jocelyn P. Siplon, CARTS 2002: 22nd Capacitor and Resistor Technology Symposium, 25-29 March 2002, pp.67-80.

Google Scholar

[12] D. Wu, T. A. Lograsso and J. W. Anderegg: J. Electron. Mater. Vol. 36(5) (2007), p.555.

Google Scholar

[13] L. Mayer, R. Rickett and H. Stenemann: J. Appl. Phys. Vol. 33(3) (1962), p.982.

Google Scholar

[14] U. Lindborg: Acta Mater. Vol. 24(1976), p.181.

Google Scholar

[15] I. A. Blech and E. S. Meieran: J. Appl. Phys. Vol. 40(2) (1969), p.485.

Google Scholar

[16] SM Arnold: Plating Vol. 53(1966), p.96.

Google Scholar

[17] M. Murakami and T. S. Kuan: Thin Solid Films Vol. 66(1980), p.381.

Google Scholar

[18] Z. M. Sun and M. W. Barsoum: J. Mater. Res. Vol. 20(5) (2005), p.1087.

Google Scholar

[19] M. Liu and A. P. Xian: J. Alloys Compd. Vol. 486(2009), p.590.

Google Scholar

© 2025 Trans Tech Publications Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies. For open access content, terms of the Creative Commons licensing CC-BY are applied.
Scientific.Net is a registered trademark of Trans Tech Publications Ltd.