Physical and Mechanical Behaviors of SnCu-Based Lead-Free Solder Alloys with an Addition of Aluminium

Abstract:

The effect of Al addition on the microstructure, melting point and microhardness of SnCu-Al lead-free solder alloys were investigated with two different compositions of Al which were 1 wt% and 5 wt%. These solder alloys were fabricated through powder metallurgy (PM) method. The results showed that the melting point and the microhardness value of the SnCu-Al lead-free solder alloy were increased as the Al content increased from 1 wt% to 5 wt%. The grain growth of SnCu-Al lead-free solder alloy also tends to be retarded due to the homogenous distribution of Al at the grain boundaries.

• Periodical: Applied Mechanics and Materials (Volume 815)
• Pages: 64-68
• DOI: https://doi.org/10.4028/www.scientific.net/AMM.815.64
• Online since: November 2015
• Authors: Nisrin Adli, Nurul Razliana Abdul Razak, Norainiza Saud
• Keywords: Aluminium, Lead-Free Solder Alloy, Melting Point, Microhardness, Microstructure, Powder metallurgy, Tin Copper

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