Curing Kinetics of Octaepoxysilsesquioxane/MNA System

Zeng Ping Zhang; Guo Zheng Liang; Shuan Fa Chen

doi:10.4028/www.scientific.net/AMM.84-85.42

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 84-85Curing Kinetics of Octaepoxysilsesquioxane/MNA...

Curing Kinetics of Octaepoxysilsesquioxane/MNA System

Abstract:

Polyhedral oligomeric silsesquioxane (POSS) can be added to polymers to prepare the organic/inorganic hybrid materials. Octaepoxysilsesquioxane (E-POSS) containing eight reactive epoxy groups in a molecule is one of the important POSSs. E-POSS was cured with methylnadic anhydride (MNA) in this study. The curing kinetics of the E-POSS/MNA system was studied by using differential scanning calorimetry (DSC). Two different kinds of methods, Kinssinger and Flynn-Wall-Ozawa, were used to calculate the activation energy and pre-exponential factor of the curing reaction.

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Periodical:

Applied Mechanics and Materials (Volumes 84-85)

Pages:

42-46

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.84-85.42

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Online since:

August 2011

Authors:

Zeng Ping Zhang, Guo Zheng Liang, Shuan Fa Chen

Keywords:

Anhydride, Curing Kinetics, Hybrid Material, Octaepoxysilsesquioxane

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