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Elimination of Bond Pad Crack through Application of Initial Force via Force Profiling on Sensitive Bond Pads

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Abstract:

Emerging designs of devices require sophisticated bond pad architecture to meet certain specifications, design applications, as well as package requirements. Sophisticated bond pad structures often have thin metal layers and POA circuit bond pads underneath which require careful application of wire bond processing to avoid cracking on the bonding pads during wire bond. Bond pad crack is one of the most detrimental issues at wire bonding, especially with POA devices, so it is important to take into consideration the wire material to be used, the process parameter to be defined, as well as the structure of the bonding pad. This paper aims to resolve and eliminate the bond pad crack by the application Initial Force via Force Profiling, whilst adhering to the output response criteria at wire bond, and not going outside the defined process parameter window. Furthermore, this paper aims to help readers to have a more comprehensive understanding of the Force parameters at wire bond, as well as the different architecture of bonding pads.

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Info:

Periodical:

Applied Mechanics and Materials (Volume 935)

Pages:

223-228

DOI:

https://doi.org/10.4028/p-i4s8Wv

Citation:

Cite this paper

Online since:

April 2026

Authors:

Glenn Carlo Miranda*

Keywords:

Bond Pad Crack, Classical Wire Bonding, Force Profiling, Initial Force, Pad Over Active (POA) Circuit Bond Pads, Wire Bonding

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Сopyright:

© 2026 Trans Tech Publications Ltd. All Rights Reserved

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* - Corresponding Author

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