Numerical Investigations on the Grinding Forces in Ultrasonic Assisted Grinding of SiC Ceramics by Using SPH Method

Zhi Qiang Liang; Zhao Yang Mi; Xi Bin Wang; Tian Feng Zhou; Yong Bo Wu; Wen Xiang Zhao

doi:10.4028/www.scientific.net/AMR.1017.735

Paper Titles

Measuring Surface Topography of a Diamond Wire Using an Image Processing Method
p.709

Effect of Surface Profile on the Material Removal Rate Distribution in CMP Process
p.715

Chemical Mechanical Polishing of Soft-Brittle Cadmium Zinc Telluride Wafers Using a Developed Environment-Friendly Solution
p.720

Effectiveness Evaluation of Novel Pad Dressing Method by Flexible Fiber Dresser - Tool Life Evaluation of Flexible Fiber Dresser
p.726

Numerical Investigations on the Grinding Forces in Ultrasonic Assisted Grinding of SiC Ceramics by Using SPH Method
p.735

The Influence of Amplitude on Grinding Force and Surface Roughness in Ultrasonic Assisted Grinding of K9 Glass
p.741

High-Speed Capturing of Stress Distribution of Workpiece under Ultrasonically Assisted Cutting Condition
p.747

Effect of Frequency and Amplitude on the Performance of Elliptic Vibration-Assisted Cutting of Fibre-Reinforced Polymer Composites
p.753

Smoothed Particle Hydrodynamics Simulations for Ultrasonic Machining of Different Workpiece Materials
p.758

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1017Numerical Investigations on the Grinding Forces in...

Numerical Investigations on the Grinding Forces in Ultrasonic Assisted Grinding of SiC Ceramics by Using SPH Method

Abstract:

In this study, the grinding force variation mechanism in ultrasonic assisted grinding (UAG) of SiC ceramic is investigated by simulation method using a single diamond abrasive grain scratching. In simulation, the workpiece is modeled by smoothed particle hydrodynamic (SPH) method while the abrasive grain is modeled by finite element method (FEM). To reliably predict the grinding forces in UAG, an analytical model of average undeformed chip thickness h_a is established. Grinding forces under different grinding parameters, i.e., depth of cut, and different ultrasonic vibration amplitudes are calculated by setting average undeformed chip thickness h_a as scratching depth during SPH simulation process. The simulation results indicate that the normal force in UAG is reduced by about 20%, while the tangential force decreases up to 30% compared with those in conventional grinding (CG). The influences of grinding parameters and ultrasonic vibration on grinding forces will be investigated and the preliminary explanations will be presented.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volume 1017)

Pages:

735-740

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1017.735

Citation:

Cite this paper

Online since:

September 2014

Authors:

Zhi Qiang Liang*, Zhao Yang Mi, Xi Bin Wang, Tian Feng Zhou, Yong Bo Wu, Wen Xiang Zhao

Keywords:

Grinding, Grinding Force, SiC Ceramic, Smoothed Particle Hydrodynamic Method (SPH), Ultrasonic Assisted Grinding (UAG)

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] Z. Q. Liang, X.B. Wang, Y. B. Wu: Int. J. Mach. Tools Manuf., 71 (2013) 41-51.

Google Scholar

[2] Z. Q. Liang, Y .B. Wu, X .B. Wang: Int. J. Mach. Tools Manuf., 50(8) (2010) 728-736.

Google Scholar

[3] L. Lucy: Astron. J. 82 (1977) 1013-1024.

Google Scholar

[4] R. A. Gingold, et al.: Royal Astronomical Society, Monthly Notices. 181 (1977) 375-389.

Google Scholar

[5] X. G. Guo, et al.: Int J Adv Manuf Technol. 68 (2013) 1277-1283.

Google Scholar

[6] J. Limido, et al.: International Journal of Mechanical Sciences. 49 (2007) 898-908.

Google Scholar

[7] S. Agarwal, P. V. Rao: Int. J. Mach. Tools Manuf. 48 (2008) 698-710.

Google Scholar

[8] S. Malkin. Grinding technology, theory and applications of machining with abrasives, Ellis Horwood, Chichester, (1989).

Google Scholar

[9] Y. B. Wu, et al.: Materials Science Forum. 471-472 (2004) 101-106.

Google Scholar

[10] S. Duane, Khahn Bui, Christian Kaufmann. Implementation and Validation of the Johnson-Holmquist Ceramic Material Model in LS-Dyna. 4th European LS-DYNA Users Conference, Material I, D-I, 47-60.

Google Scholar