Measuring Surface Topography of a Diamond Wire Using an Image Processing Method

Abstract:

Photovoltaic power, a well known renewable energy source, has been introduced on a global basis. A popular variation has many solar battery cells constituted by a polycrystalline or a single crystal silicon wafer. Therefore each cell’s conversion efficiency from solar energy to electrical energy is very essential. Recently, a fixed grain wire method, in which the wafer is sliced by a wire fixing grains on the surface with a bond or an electrodeposition, is employed in that slicing process. Thus, the wire surface topography must be obtained in order to sustain reliable accuracy. In this paper, the measurement method of a diamond wire surface topography using an image processing method is proposed. According to this method, the distribution of grains on the surface can be expressed numerically after grains are extracted from the captured images of the wire surface. Finally, the effectiveness of the proposed scheme was verified through a measurement experiment for a diamond wire.

• Periodical: Advanced Materials Research (Volume 1017)
• Pages: 709-714
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.1017.709
• Online since: September 2014
• Authors: Akihiro Sakaguchi*, Tomoyuki Kawashita, Shuji Matsuo
• Keywords: Slicing, Abrasive Grain, Diamond Wire, Image Processing, Moving Image, Resin Bond

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