Future Prospects for CMP Equipment - Design Considerations According to Substrate Size and Shape

Abstract:

CMP Technology is still expanding its application field to realize planarization of complicated structures for More-Moore and More-than-Moore devices. The CMP equipment has been developed based on simple rotary motion but with more sophisticated systems for 300mm wafer applications. This paper deals with future prospects of the CMP equipment for micro-and nanopatterns on different types of substrate which are recently on demand to meet technological requirements. These industrial environments make equipment makers grow out of insisting rotary type motions anymore and get new opportunities. This paper describes basic design considerations according to substrate size and shape, and shows a couple of examples for not only large sized wafer, display panels and printed circuit boards, but also thin, flexible and continuous films. Finally, we hope that the design considerations for future CMP equipment make many discussions and solutions to achieve higher quality and throughput in the field.

• Periodical: Advanced Materials Research (Volume 1017)
• Pages: 705-708
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.1017.705
• Online since: September 2014
• Authors: Hae Do Jeong*, Hyoung Jae Kim, Hon Jong Choi
• Keywords: CMP Equipment, Design Considerations, Substrate

References

[1] Y. Park, J. An, H. Kim and H. Jeong: Impact of edge profile control ring on wafer removal rate and uniformity in chemical mechanical polishing, Proceedings of International Conference on Planarization/ CMP Technology 2011, pp.647-652.