Numerical and Experimental Research of the Slurry Film in Chemical Mechanical Polishing (CMP)

Abstract:

A three-dimensional hydrodynamic lubrication model for chemical-mechanical polishing is presented based on the Reynolds equation and Reynolds boundary condition. By solving the Reynolds equation, the slurry film pressure distribution has been obtained. The effects of minimum film thickness and the wafer tile angle on the film pressure are analyzed, and the influence of the polishing applied load and rotation speed on slurry film thickness and tilt angle are discussed. At last, by experiment, it is found that the simulation results are similar to experiment results which film thickness is increasing with the increasing of rotation speed, decreasing of the applied load. It is proved that the simulation is reliable.

• Periodical: Advanced Materials Research (Volumes 102-104)
• Pages: 669-674
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.102-104.669
• Online since: March 2010
• Authors: Fei Yan Lou, Qian Fa Deng, Ju Long Yuan
• Keywords: Chemical Mechanical Polishing (CMP), Minimum Film Thickness, Tilt Angle

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