Optimization of Molding Process Parameters for the CPU Fan Based on Orthogonal Experiment

Abstract:

In this paper, the main molding process parameters which are relevant to warpage were optimized by orthogonal experiment and finite element software MPI. The result shows that we can get a series of optimized parameters and know how much each process parameter influences the warpage by combining orthogonal experiments with simulation experiments using MPI, while fewer experiments are needed. Verified by MPI, such series of optimized parameters can keep the warpage in a low level and completely meet the standard of the product.

• Periodical: Advanced Materials Research (Volumes 102-104)
• Pages: 7-11
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.102-104.7
• Online since: March 2010
• Authors: Cong Da Lu, Yi Lian Zhang, Shao Fei Jiang, Guo Zhong Chai
• Keywords: Fan, MPI Software, Optimization, Process Parameter

References

[1] X.P. Chen, R.F. Hu and S.G. Hu: Light Industry Machinery, Vol. 25 (2007), pp.23-26.

[2] W.B. Wang: Moldflow Video Tutorial: Case �avigation of Injection & Flow Analysis (Chinese) (Tsinghua University Press, Beijing 2008).

[3] G. Wang and Y. Shan: Applications of Mould Analysis (Tsinghua University Press, Beijing 2005).

[4] C.X. Yang, et al: Chinese Journal of Electron Devices, Vol. 30 (2007), pp.1846-1851.

[5] H.B. He, Y.M. Deng and H.L. Li: Light Industry Machinery, Vol. 24 (2008), pp.24-26.

[6] A.X. Feng: Plastic Forming Technology (Chemical Industry Press, Beijing 2004).

[7] W.G. Wang, B.S. Tian and Y.C. Tian: Skills and Examples of Plastic Injection Mold Design (Chemical Industry Press, Beijing 2001).

[8] F.Y. Xu: Practical Mold Design and Manufacturing Manual (China Machine Press, Beijing 2001).

[9] M.L. Wu and L. Zhang: Light Industry Machinery, Vol. 24 (2008), pp.24-26.