Optimization of Molding Process Parameters for the CPU Fan Based on Orthogonal Experiment

Abstract:

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In this paper, the main molding process parameters which are relevant to warpage were optimized by orthogonal experiment and finite element software MPI. The result shows that we can get a series of optimized parameters and know how much each process parameter influences the warpage by combining orthogonal experiments with simulation experiments using MPI, while fewer experiments are needed. Verified by MPI, such series of optimized parameters can keep the warpage in a low level and completely meet the standard of the product.

Info:

Periodical:

Advanced Materials Research (Volumes 102-104)

Edited by:

Guozhong Chai, Congda Lu and Donghui Wen

Pages:

7-11

DOI:

10.4028/www.scientific.net/AMR.102-104.7

Citation:

C. D. Lu et al., "Optimization of Molding Process Parameters for the CPU Fan Based on Orthogonal Experiment", Advanced Materials Research, Vols. 102-104, pp. 7-11, 2010

Online since:

March 2010

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Price:

$35.00

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