Present Situation and Development Trend of Precise Wire Cutting Technology of Silicon Wafers

Abstract:

With the rapid development of IC and photovoltaic industry, the requirements of larger-diameter, better productivity, higher machining accuracy and finer surface quality of silicon wafers challenge traditional wafer cutting technology. Therefore, in terms of increasing wafers’ diameter, lessening slicing thickness, reducing cutting loss and improving machining efficiency, research and application of precision cutting technology become necessary and urgent. The paper analyzes current well-developed technologies and equipments of free abrasive wire cutting in detail. It is recommended that bonded abrasive diamond wire cutting will be the development trend in the future as a highly-efficient, low material waste and environmentally friendly technology of precise cutting of silicon wafers. The paper also makes a discussion on construction, working principle, and manufacturing technology of bonded abrasive diamond wires.

• Periodical: Advanced Materials Research (Volumes 102-104)
• Pages: 762-766
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.102-104.762
• Online since: March 2010
• Authors: Hong Wen Du, Yuan Zheng Yu
• Keywords: Development Trend, Precise Wire Cutting, Present Situation, Silicon Wafer

References

[1] P.O. Hahn: Microelectronic Engineering, (2001), pp.3-13.

[2] Shayne La Force. The new DBC Process, TAP technology, (2001), pp.71-73.

[3] Ernst Gaulhofer and Heinz Oyrer. IEMT Europe 2000 Symposium, Mynich, Germany.

[4] M. Bhagavat, V. Prasad and I. Kao: ASME Journal of Tribology, (2000), p.122.

[5] S. Nishijima, et al: IEEE Transactions on Applied Superconductivity, (2003).

[6] H. Suwabe, K. Ishikawa and A. Kitajima: Proceedings of ASPE, (2001).

[7] K. Ishikawa, et al: Proceedings of Advances in Abrasive Technology, (2002).

[8] K. Ishikawa, H. Suwabe and S. Itoh: Proceedings of ASPE, (2003).

[9] W.I. Clark, et al: International Journal of Machine Tools and Manufacture, Vol. 43 (2003).

[10] W.I. Clark, et al: International Journal of Machine Tools and Manufacture, Vol. 43 (2003).

[11] John, et al, In: NCPV and Solar Program Review Meeting, (2003).