Study on Process Parameters in CMP Ultra-Thin Stainless Steel Sheet

Abstract:

Chemical mechanical polishing (CMP) is the most effective technology to achieve ultra-smooth without damage surface in ultra-precision machining of stainless steel substrate. In this paper, according to the slurry ingredients obtained by former research, the influences of the CMP process parameters, such as the rotational velocity of the platen and the carrier, the polishing pressure and the abrasive size on the material removal rate (MRR), have been studied in CMP stainless steel substrate based on the alumina (Al₂O₃) abrasive. The research results show that the material removal rate increases with the increase of the abrasive size, the rotational velocity of the platen and the polishing pressure significantly and the surface roughness increases with the increase of the abrasive size. This study results will provide the reference for optimizing the process parameters and researching the material removal mechanism in CMP stainless steel sheet.

• Periodical: Advanced Materials Research (Volume 1027)
• Pages: 58-62
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.1027.58
• Online since: October 2014
• Authors: Hai Feng Cheng*, Li Jie Ma, Jian Guo Yao, Jian Xiu Su
• Keywords: Chemical Mechanical Polishing, Material Removing Rate, Ultra-Thin Stainless Steel Sheet

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