[1]
Gong Zhuqing, Deng Shuhao. Pulse electrodeposition of nanocrystalline Ni-Fe-Cr alloy. Electro deposition technology [J]-Transactions of Nonferrous Metals Society of China, 2003(2): 511-516.
DOI: 10.1016/s1003-6326(19)65166-6
Google Scholar
[2]
Zhou Zhipeng, Hu Yaohong, Chen Lige Effect and removal of impurities in the Sulfate Trivalent Chromium Plating Process [J]. Electroplating & Finishing, 2008, 27(5): 11~13.
Google Scholar
[3]
Yang Yufang, Gong Zhuqing, Li Qiangguo. Electro deposition of Ni-Fe-Cr alloy on Fe substrate[J]. Electroplating & Finishing, 2007(10).
Google Scholar
[4]
Yang Yufang, Gong Zhuqing, Deng Liyuan. Trivalent chromium plating electrodeposition of nanocrystalline Fe-Ni-Cr alloy foil fluid [J] Journal of Central South University (natural science), 2006(3).
Google Scholar
[5]
Tu Zhenmi, Yang Zhelong.Study on electrochemical trivalent chromium formate electroplating solution. Journal of Materials Protection, 1985, 18(6):8~11.
Google Scholar
[6]
Dai Hongbin, Wang Guobin. Study of sulfamate plating nickel iron alloy organization structure [J]. Surface Technology, 1996(01).
Google Scholar
[7]
Wu Huimin. Research on full Sulfate Trivalent Chromium Electroplating Chromium [D]; Wuhan University, (2004).
Google Scholar
[8]
Liu Jianping, Hu Yaohong, Zhan Yiteng; Research and development of trivalent chromium plating [J]. Surface technology, 2003(03).
Google Scholar
[9]
Deng Shuhao, Gong Zhuqing, Yi Danqing, Su Yuchang. The reduction mechanism of trivalent chromium electrodeposition. Journal of Central South University (natural science), 2005, 36(2): 214~218.
Google Scholar
[10]
Yin Yongjia. Handbook of University Chemistry. Ji'nan[M]. Shandong science and Technology Press, (1985).
Google Scholar