Research on Vibration Stress Relief for Cured SU-8 Photoresist Layer

Qun Feng Yang; Jian Yi Zheng; Jun Qing Wang; Xue Nan Zhao; Da Yin Wei; Gao Feng Zheng

doi:10.4028/www.scientific.net/AMR.1094.487

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1094Research on Vibration Stress Relief for Cured SU-8...

Research on Vibration Stress Relief for Cured SU-8 Photoresist Layer

Abstract:

The aim of this work is to reduce the residual stress in cured SU-8 Photoresist layer by vibration stress relief (VSR) method. The vibration device was designed according to the results of the ANSYS modal simulation, which was used for the thin film VSR. Meanwhile, some important influencing factors, such as the excitation current and the vibration time, have been discussed. The residual stress in the SU-8 layer was measured by profile method, and the values of residual stresses in the SU-8 layer before and after VSR were compared. The experimental results show that residual stress in SU-8 layer can be effectively eliminated or homogenized by VSR if the proper vibration parameters were chosen in the experiment.

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Periodical:

Advanced Materials Research (Volume 1094)

Pages:

487-490

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1094.487

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Online since:

March 2015

Authors:

Qun Feng Yang*, Jian Yi Zheng, Jun Qing Wang, Xue Nan Zhao, Da Yin Wei, Gao Feng Zheng

Keywords:

Profile Method, Residual Stress, SU-8 Photoresist Layer, Vibration Stress Relief (VSR)

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