The Microstructure Evolutions of Sn-0.7Cu Solder Using Microwave-Assisted Sintering Method at Various Exposure Times

Flora Somidin; Norainiza Saud; Mohd Arif Anuar Mohd Salleh

doi:10.4028/www.scientific.net/AMR.1107.582

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1107The Microstructure Evolutions of Sn-0.7Cu Solder...

The Microstructure Evolutions of Sn-0.7Cu Solder Using Microwave-Assisted Sintering Method at Various Exposure Times

Abstract:

This study investigates the effect of microwave-assisted sintering on microstructure evolution and microhardness of Sn-0.7Cu green compact solder. Results showed that microwave-assisted sintering has shortened the sintering duration compared to conventional process. Microstructural characterization revealed that the 800W (2.45GHz) microwave power combined with SiC microwave susceptor heating showed rapid particle grain evolution within 120 seconds. In order to get similar grain evolution, 2 hours of sintering duration was needed for conventional sintering. Results were also revealed that the microhardness of the Sn-0.7Cu green compact also decreased as the microwave exposure time is increased.

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Periodical:

Advanced Materials Research (Volume 1107)

Pages:

582-586

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1107.582

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Online since:

June 2015

Authors:

Flora Somidin*, Norainiza Saud, Mohd Arif Anuar Mohd Salleh

Keywords:

Microhardness, Microstructure, Microwave-Assisted Sintering, Sn-0.7Cu

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References

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