Transport Characteristics of Secondary Charged Particles Resulting from High Energy Neutron in Silicon

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Silicon is always the dominant semiconductor material of the modern semiconductor industry. This is as silicon can retain its semiconductor characteristics even at a higher temperature while the other semiconductor materials can't. However, when a silicon device is exposed to a flux of energetic radiation or particles, the effects from the radiation and the induced secondary particles can cause several degradation of the device performance. For the purpose of investigate the resultant effects from the bombardment of neutrons and the behavior of secondary charged particles in the silicon model, the neutron displacement defect was measured in situ and then followed by the simulation based on Monte Carlo method. The bombardment of neutron in the silicon model produce at least three secondary particles, which are alpha ˸α˹ particles, proton (p) particles and silicon recoil atoms, through the reactions of ˸̾˼α˹˼˰˸̾˼̀˹˰and neutron scattering respectively. The kinetic energy and range of these charged particles are different among themselves, and thus the probability of hitting and degradation effects in the silicon materials are varies. The simulation calculation showed that ˸̾˼α˹˰reaction induced soft error cross section of about 8.7 x 10-14 cm2 and for recoil atoms, it is about 2.9 x 10-15 cm2. There was no error of the silicon device configuration induced by proton particles until 1010 n/cm2.neutron fluence. It can be concluded that the largest portion of error in the silicon model is induced by the secondary alpha ˸α˹ particles.

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79-84

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June 2015

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© 2015 Trans Tech Publications Ltd. All Rights Reserved

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[1] E. E. Conrad, G. A.Gurtman, G. Kweder, M. J. Mandell and W. W. White, Collateral Damage to Satellites from an EMP Attack.  Defense Threat Reduction Agency Fort Belvoir VA (2010) No. DTRA-IR-10-22.

Google Scholar

[2] M. T. Freeman, Spacecraft on-orbit deployment anomalies: What can be done? Aerospace and Electronic Systems Magazine, IEEE. 8(4), (1993) 3-15.

DOI: 10.1109/62.210636

Google Scholar

[3] H. L. Hughes and J. M. Benedetto, Radiation Effects and Hardening of MOS Technology: Devices and Circuits. Nuclear Science, IEEE Transactions on 50(3), (2003). 500-521.

DOI: 10.1109/tns.2003.812928

Google Scholar

[4] R. Katamreddy, R. Inman, G. Jursich, A. Soulet and C. Takoudis, ALD and Characterization of Aluminum Oxide deposited on Si (100) using tris (diethylamino) Aluminum and Water Vapor. Journal of The Electrochemical Society. 153(10), (2006), 701-706.

DOI: 10.1149/1.2239258

Google Scholar

[5] G. F. Knoll, Radiation Detection and Measurement, Wiley. Com, 2010.

Google Scholar

[6] H. F. Abdul Amir and A.Chik, Neutron radiation effects on metal oxide semiconductor (MOS) devices. Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 267(18), (2009) 3032-3036.

DOI: 10.1016/j.nimb.2009.06.051

Google Scholar

[7] F. P. Chee, H. F. A. Amir and S. Salleh, System Design for Enhanced in situ Monitoring of Ionizing Radiation Effects In Semiconductor Devices. A Journal of Science and Technology. 2 (2008) 59-69.

Google Scholar