Mechanical Properties of Wheat Straw Particleboard Using Composite Adhesives

Yan Hua Zhang; Ji You Gu; Ying Feng Zuo; Ming Wei Di; Hai Yan Tan; Li Bin Zhu

doi:10.4028/www.scientific.net/AMR.113-116.2096

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 113-116Mechanical Properties of Wheat Straw Particleboard...

Mechanical Properties of Wheat Straw Particleboard Using Composite Adhesives

Abstract:

The purpose of the study was to use a cheap wheat straw to manufacture particleboard. Wheat straws offer great promise and new challenges as replacement for wood in processed wood products. The particleboard was produced using composite adhesive which the urea-formaldehyde (UF) adhesives modified by emulsifiable polymeric methylene diphenyl diisocyanate (EPU). The properties of the particleboard was evaluated by measuring internal bonding strength(IB), thickness swelling, modulus of rupture(MOR), modulus of elasticity (MOE) and formaldehyde emission. The optimal condition was chosen at density of 0.75g/cm3, UF/EPU ratio of 70/30, adhesive amounts of 10% based on the dry amounts of wheat straw. The test results showed that maximum dry internal bonding strength, wetting internal bonding strength, modulus of rupture, modulus of elasticity was 0.45MPa, 0.072MPa, 31.50MPa and 4564MPa, respectively. The thickness swelling (TS2h) and thickness swelling (TS24h) was 3.51% and 11.1%, respectively. The free formaldehyde of wheat straw particleboard reached E0-type national standards.

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Advanced Materials Research (Volumes 113-116)

Pages:

2096-2099

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https://doi.org/10.4028/www.scientific.net/AMR.113-116.2096

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Online since:

June 2010

Authors:

Yan Hua Zhang, Ji You Gu, Ying Feng Zuo, Ming Wei Di, Hai Yan Tan, Li Bin Zhu

Keywords:

Composite Adhesive, Mechanical Property, Particleboard, Wheat Straw

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