Study on the Slicing of Sapphire Using a Wire Tool

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This work examined improvements in cutting efficiency obtained during the slicing of sapphire workpieces when adding CeO2 to the cutting fluid. Various machining parameters, including the cutting temperature, machining surface tolerance, surface quality and tool wear, were assessed. It was confirmed that both the cutting temperature and the machining surface tolerance are reduced by the presence of CeO2 in the cutting fluid. Observations of the machined surfaces and the cutting tool also demonstrated that both brittle fracturing of the surface and loss of abrasive grains were suppressed following the addition of CeO2. These results suggest that the cutting temperature likely affects the accuracy of the cutting process and that CeO2 appears to improve cutting efficiency by reducing the workpiece temperature and by stabilizing the cutting process.

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Periodical:

Edited by:

Hon-Zong Choi, Haedo Jeong, Xiping Xu and Hideki Aoyama

Pages:

333-337

Citation:

M. Shinya et al., "Study on the Slicing of Sapphire Using a Wire Tool", Advanced Materials Research, Vol. 1136, pp. 333-337, 2016

Old Citation:

M. Shinya, T. Yazawa, T. Otubo, "Study on the Slicing of Sapphire Using a Wire Tool", Advanced Materials Research, Vol. 806, pp. 333-337, Nov. 2015

Online since:

January 2016

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[2] T. Yazawa, (2012) Abrasive Technology Conference in Kyoto pp.108-109.

[3] Y. Kinosita, (2012) Japan Soc. of Precision Engineering in Hukuoka.