Study on the Slicing of Sapphire Using a Wire Tool

Abstract:

This work examined improvements in cutting efficiency obtained during the slicing of sapphire workpieces when adding CeO₂ to the cutting fluid. Various machining parameters, including the cutting temperature, machining surface tolerance, surface quality and tool wear, were assessed. It was confirmed that both the cutting temperature and the machining surface tolerance are reduced by the presence of CeO₂ in the cutting fluid. Observations of the machined surfaces and the cutting tool also demonstrated that both brittle fracturing of the surface and loss of abrasive grains were suppressed following the addition of CeO₂. These results suggest that the cutting temperature likely affects the accuracy of the cutting process and that CeO₂ appears to improve cutting efficiency by reducing the workpiece temperature and by stabilizing the cutting process.

• Periodical: Advanced Materials Research (Volume 1136)
• Pages: 333-337
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.1136.333
• Online since: January 2016
• Authors: Moriyama Shinya, Takanori Yazawa, Tatsuki Otubo
• Keywords: Abrasive Diamond Grain, CeO₂, Cutting Temperature, Electrodeposition Wire Tool, Machining Mechanism, Multi-Wire Saw, Sapphire, Thermocouple, Wafer Thickness Tolerance

References

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