Study on Precision Slicing Process of Single-Crystal Silicon by Using Dicing Wire Saw

Takaaki Suzuki; Toshinori Otsuki; Ji Wang Yan

doi:10.4028/www.scientific.net/AMR.1136.350

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Study on Precision Slicing Process of Single-Crystal Silicon by Using Dicing Wire Saw
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1136Study on Precision Slicing Process of...

Study on Precision Slicing Process of Single-Crystal Silicon by Using Dicing Wire Saw

Abstract:

Precision slicing tests were performed for single-crystal silicon by using a newly developed dicing wire saw system and diamond wires. The developed dicing wire saw enables slicing thick workpiece of hard and brittle materials which could not be sliced by conventional dicing machines. To achieve high precision and efficiency, the dicing wire saw system adopted tension control and high speed control technologies which provides a maximum wire feeding speed of 2000m/min. In this study, the diamond wire was driven in a single direction at a speed of 750-1750m/min and the slicing force, wire wear and workpiece surface roughness after slicing were investigated experimentally. The results showed that as a new slicing system, the developed dicing wire saw was useable for high-precision slicing of thick workpiece.

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Periodical:

Advanced Materials Research (Volume 1136)

Pages:

350-356

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1136.350

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Online since:

January 2016

Authors:

Takaaki Suzuki, Toshinori Otsuki, Ji Wang Yan*

Keywords:

Diamond Wire, Dicing Wire Saw, Fixed Abrasive Machining, Hard Brittle Material, Precision Slicing, Single-Crystal Silicon, Surface Roughness

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* - Corresponding Author

References

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