Loop Stiffness of Grinding Machine Developed for 450 mm Silicon Wafers

Jumpei Kusuyama; Shintaro Iwahashi; Takayuki Kitajima; Nagahisa Ogasawara; Akinori Yui; Hirotsugu Saito; Alexander H. Slocum

doi:10.4028/www.scientific.net/AMR.1136.655

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1136Loop Stiffness of Grinding Machine Developed for...

Loop Stiffness of Grinding Machine Developed for 450 mm Silicon Wafers

Abstract:

Increasing the wafer diameter from φ300 mm to φ450 mm is required to enhance semiconductor devices productivity. A high-stiffness rotary grinding machine equipped with water hydrostatic bearings was developed for a φ450 mm silicon wafer. The grinding machine has an upper structure consisting of a wheel spindle system and a lower structure consisting of a rotary worktable system. The spindle shaft creates both rotary and axial feeding motion. The upper and lower structures are clamped together rigidly by three kinematic couplings. A higher loop stiffness is required for the grinding machine because grinding the larger wafer requires a higher grinding force. This paper investigates the loop stiffness of the developed wafer grinding machine.

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Periodical:

Advanced Materials Research (Volume 1136)

Pages:

655-660

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1136.655

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Online since:

January 2016

Authors:

Jumpei Kusuyama*, Shintaro Iwahashi, Takayuki Kitajima, Nagahisa Ogasawara, Akinori Yui, Hirotsugu Saito, Alexander H. Slocum

Keywords:

Loop Stiffness, Rotary Grinding Machine, Silicon Wafer, Water Hydrostatic Bearing

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References

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