Application of the Ultrasound-Infrared Thermography Technique for Non-Destructive Evaluation of Defects in Shoe Bonding Parts

Seung Hyun Choi; Lee Ku Kwac; Jae Yeol Kim

doi:10.4028/www.scientific.net/AMR.123-125.823

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 123-125Application of the Ultrasound-Infrared...

Application of the Ultrasound-Infrared Thermography Technique for Non-Destructive Evaluation of Defects in Shoe Bonding Parts

Abstract:

The infrared thermography technique is being applied in many areas. Particularly these days, non-destructive inspection and evaluation using the ultrasound-infrared thermography technique are hogging the spotlight in a wide range of study areas. The ultrasound-infrared thermography technique uses the principle that ultrasound waves projected to objects with cracks or defects at connections generate local heat from the defective surface. In this research, introduce nondestructive evaluation method for total inspection of special shoes applying Ultrasound Infrared thermography Technique. Performance of the proposed method are shown by through thermo-Image. The total inspection system using infrared thermal camera for special shoes, its applicability, and system configuration are introduced.

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Periodical:

Advanced Materials Research (Volumes 123-125)

Pages:

823-826

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.123-125.823

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Online since:

August 2010

Authors:

Seung Hyun Choi, Lee Ku Kwac, Jae Yeol Kim

Keywords:

Delamination, NDE, Shoes Bonded Area, Ultrasound Infrared Thermography

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