Diamond Pad Conditioners with Oriented Polycrystalline Diamond Cubes

Ying Tung Chen; Ta Wei Lin; Yunn Shiuan Liao; Jung Sheng Chen; Chao Yu Lin; James C. Sung

doi:10.4028/www.scientific.net/AMR.126-128.326

Paper Titles

Effects of Wafer Carrier Design on Contact Stress Uniformity in CMP
p.305

Study on Chemical Mechanical Polishing with Ultrasonic Vibration
p.311

Experimental Investigation on Effects of Passivants in the Abrasive-Free Polishing of Copper Film
p.316

Friction Phenomenon in Chemical Mechanical Polishing of Oxide Film
p.320

Diamond Pad Conditioners with Oriented Polycrystalline Diamond Cubes
p.326

Mosaic Diamond Disks with Brazed Pallets for CMP
p.332

Estimation of Heat Transfer Coefficients in Dry and Cold-Air Cutting
p.341

Tool Life and Surface Roughness of FCD 700 Ductile Cast Iron when Dry Turning Using Carbide Tool
p.347

Effects of Cutting Fluid with Nano Particles on the Grinding of Titanium Alloys
p.353

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 126-128Diamond Pad Conditioners with Oriented...

Diamond Pad Conditioners with Oriented Polycrystalline Diamond Cubes

Abstract:

Sintered polycrystalline diamond cubicles were oriented to make CMP pad conditioners. The dressing experiments demonstrated the capability of fast pad cutting and efficient removal of glazed layer that is formed by polishing wafers with slurry on dressed pad.

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Periodical:

Advanced Materials Research (Volumes 126-128)

Pages:

326-331

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.126-128.326

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Online since:

August 2010

Authors:

Ying Tung Chen, Ta Wei Lin, Yunn Shiuan Liao, Jung Sheng Chen, Chao Yu Lin, James C. Sung

Keywords:

CMP, Diamond Orientation, Pad Dressing, PCD

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References

[1] J. Sung, and Y. L. Pai: CMP Pad Dresser：A Diamond Grid Solution, Proceedings of the Society of Grinding Engineers (2000), pp.189-196.

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[2] Y. T. Chen, C. Y. Lin, J. C. Sung, C. S. Chou, M. Y. Tsai and M. Sung: The Clear Cutting of CMP Pads By Polycrystalline Diamond Blades, International Conference on Planarization/CMP Technology (2008), pp.112-118.

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[3] C. M. Sung and M. Sung, U.S. Patent Application 20090068937. (2009).

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