Identification of Brittle-Ductile Material Removal Characteristics in Ultrasonic Aided Lapping of Engineering Ceramics

Abstract:

For the precision engineering ceramics parts, semi-ductile regime machining technologies are usually adopted to obtain the final surface. It is very important to research the brittle-ductile material removal characteristics and corresponding monitoring technology in ultrasonic aided lapping of engineering ceramics to obtain better surface quality. A series of lapping tests were carried out in the paper and the influence law of lapping parameters on the ductile percentage of ultrasonic lapped surface was achieved, which enables to off-line identify the material removal characteristics. Though the material removal characteristics can be online judged through monitoring the ratio of lapping component forces qualitatively, the monitoring effect is worse just because of lower response frequency of dynamometer and the relativity of lapping force. In this paper, a novel online monitoring technology of material removal characteristics is put forward based on AE technology. Through the wavelet package analysis of AE signals, the discrimination index and standard of material removal characteristics can be obtained. It is proved that this technology can realize online identification of the brittle-ductile material removal characteristics in ultrasonic aided lapping of engineering ceramics effectively.

• Periodical: Advanced Materials Research (Volumes 126-128)
• Pages: 487-492
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.126-128.487
• Online since: August 2010
• Authors: Feng Jiao, Chong Yang Zhao, Bo Zhao
• Keywords: Engineering Ceramic, Material Removal Characteristics, Ultrasonic Aided Lapping

References

[1] Bifano T G, Dow T A, Scattergood R O. Journal of Engineering for Industry. Vol. 113 (1991), pp.184-489.

[2] Beltrao P A, Gee A E, Corbett J, et al. CIRP Annals - Manufacturing Technology. Vol. 48 (1999), pp.437-440.

[3] Hiroshi E, Jun S, Zhou L. International Conference on Optical Engineering for Sensing and Nanotechnology, (1999).

[4] Ke Hongfa, Zhang Yaohui, et al. Diamond & Abrasives Engineering. Vol. 109 (1999), pp.18-20.

[5] Ke Hongfa, Zhang Yaohui, et al. Diamond & Abrasives Engineering. Vol. 103 (1998), P. 25-28.

[6] Tian Xinli, Yu Aibing: Theory and Technology of Engineering Ceramic Machining. (Defence Industry Press, China, 2006).

[7] Qu W, Wang K, Miller M H, et al. Precision Engineering. Vol. 24 (2000), pp.329-337.

[8] Lee Y: Monitoring and planning for open architecture manufacturing of precision machining using acoustic emission. (Dissertation, . Berkeley: University of California, 2000).

[9] Daniel J P: Applications of Quantitative Acoustics in Monitoring Precision Manufacturing. (Dissertation, . Berkeley: University of California, 1996).

[10] Chen X: Monitoring and Analysis of Ultra-Precision Machining Processes using Acoustic Emission. (Dissertation, . Berkeley: University of California, 1998).