Chemical Effect on the Material Removal Rate in the CMP of Silicon Wafers
This paper investigates the effects of some chemical factors on the material removal rate (MRR) in chemo-mechanical polishing (CMP) of Si (100) wafers. The CMP was carried out in alkaline slurry using alumina and ceria particles with hydrogen peroxide. When using the alumina particles, the MRR initially decreases with increasing the slurry pH value until pH = 9. Nevertheless, the application of the ceria particles increases the MRR before the pH of the slurry reaches 10. A higher slurry flow rate brings about a greater MRR.
Yunn-Shiuan Liao, Chao-Chang A. Chen, Choung-Lii Chao and Pei-Lum Tso
Y. G. Wang et al., "Chemical Effect on the Material Removal Rate in the CMP of Silicon Wafers", Advanced Materials Research, Vols. 126-128, pp. 511-514, 2010