Research on Axisymmetric Free-Form Creation with Rotating Polishing Tool

Shingo Tsubota; Wataru Natsu

doi:10.4028/www.scientific.net/AMR.126-128.499

Paper Titles

Research on the With-In Wafer Non-Uniformity (WIWNU) of the Large Quadrate Optic in the Fast Polishing Process
p.475

Fabrication of Small Polishing Tool by Using Electrophoresis Phenomenon
p.481

Identification of Brittle-Ductile Material Removal Characteristics in Ultrasonic Aided Lapping of Engineering Ceramics
p.487

Evaluation of Polished Surface for Viscoelastic Polymer
p.493

Research on Axisymmetric Free-Form Creation with Rotating Polishing Tool
p.499

Simulation Study of Sliding Control for Constant Polishing Force Using an Innovative Sphere-Like Polishing Tool on a Machining Center
p.505

Chemical Effect on the Material Removal Rate in the CMP of Silicon Wafers
p.511

On the Technologies of Electrochemical Mechanical Finishing
p.515

EDM Properties of EC-PCD Using a Copper Electrode
p.521

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Research on Axisymmetric Free-Form Creation with Rotating Polishing Tool

Abstract:

The purpose of this research is to establish a way to realize the axisymmetric free-form polishing by controlling the scanning speed of the rotating polishing tool. The scanning speed was determined by comparing the measured result of the polished shape with the target shape. Experiments with the proposed method were carried out and the effectiveness of the method was verified.