Sharpening Mechanism Using Composite Electro-Plating In-Process Sharpening Technique

Tai Jia Chen; Rong Tsong Lee; Yuang Cherng Chiou

doi:10.4028/www.scientific.net/AMR.126-128.633

Paper Titles

Effect of Ground Surface Roughness of Tool on Adhesion Characteristics of PVD Coating
p.609

Intermittent Grinding of Advanced Ceramic with the T-Tool Grinding Wheel
p.615

Characterization and Performance of Monolayer Brazed Polycrystalline CBN Abrasive Tools
p.621

Thrust Force Directional Vibration-Assisted Ductile-Mode Grinding of Single-Crystal Si
p.627

Sharpening Mechanism Using Composite Electro-Plating In-Process Sharpening Technique
p.633

Investigation on Material Property of Electrically Conductive Polycrystalline Composite Diamond (EC-PCD)
p.639

Processing EC-PCD by Constant-Force Grinding Assisted with EDM
p.645

Ultra High Speed Turning of Inconel 718 with Sialon Ceramic Tools
p.653

Analysis of Surface Topography Characteristics in Electrochemical Mechanical Finishing
p.658

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 126-128Sharpening Mechanism Using Composite...

Sharpening Mechanism Using Composite Electro-Plating In-Process Sharpening Technique

Abstract:

The in-process sharpening mechanism of the grinder during the grinding process of a CVD diamond film surface is investigated using the composite electro-plating in-process sharpening (CEPIS) technique. The bath concentration is employed to investigate the variation of coating structure deposited on the grinder. Results show that the land area ratio increases with increasing nickel chloride concentrations (NiCl2．6H2O) of the plating bath from 10 to 30 g/L, and the coating structure becomes very smooth without porous area at the nickel chloride concentration of 75 g/L. Therefore the coating structure becomes compact to hold the diamond particles rigidly. Consequently, the grinding ability of the grinder can be significantly improved, where the mirror-like surface of the CVD diamond film can be achieved.