Sharpening Mechanism Using Composite Electro-Plating In-Process Sharpening Technique

Abstract:

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The in-process sharpening mechanism of the grinder during the grinding process of a CVD diamond film surface is investigated using the composite electro-plating in-process sharpening (CEPIS) technique. The bath concentration is employed to investigate the variation of coating structure deposited on the grinder. Results show that the land area ratio increases with increasing nickel chloride concentrations (NiCl2.6H2O) of the plating bath from 10 to 30 g/L, and the coating structure becomes very smooth without porous area at the nickel chloride concentration of 75 g/L. Therefore the coating structure becomes compact to hold the diamond particles rigidly. Consequently, the grinding ability of the grinder can be significantly improved, where the mirror-like surface of the CVD diamond film can be achieved.

Info:

Periodical:

Advanced Materials Research (Volumes 126-128)

Edited by:

Yunn-Shiuan Liao, Chao-Chang A. Chen, Choung-Lii Chao and Pei-Lum Tso

Pages:

633-638

DOI:

10.4028/www.scientific.net/AMR.126-128.633

Citation:

T. J. Chen et al., "Sharpening Mechanism Using Composite Electro-Plating In-Process Sharpening Technique", Advanced Materials Research, Vols. 126-128, pp. 633-638, 2010

Online since:

August 2010

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Price:

$35.00

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