Modification of Resin and its Application to Resin-Bonded Diamond Wire Saw Manufacture
The purpose of this paper is to modify the resin binder for developing resin-bonded diamond wire saw. The optimization of components with different ratios in the resin binder was investigated using orthogonal design experiments. Besides, the resin-bonded diamond wire saw was developed using the piano wire (the diameter is 0.2mm), the modified resin and the diamond abrasive (the diameter is 20~30μm). Good surface quality and slicing performance were obtained when slicing silicon crystal using the resin-bonded diamond wire saw we made in the experiments.
Qiusheng Yan, Jiabin Lu, Jun Wang and Hang Gao
W. B. Bi et al., "Modification of Resin and its Application to Resin-Bonded Diamond Wire Saw Manufacture", Advanced Materials Research, Vol. 135, pp. 393-397, 2010