Modification of Resin and its Application to Resin-Bonded Diamond Wire Saw Manufacture

Abstract:

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The purpose of this paper is to modify the resin binder for developing resin-bonded diamond wire saw. The optimization of components with different ratios in the resin binder was investigated using orthogonal design experiments. Besides, the resin-bonded diamond wire saw was developed using the piano wire (the diameter is 0.2mm), the modified resin and the diamond abrasive (the diameter is 20~30μm). Good surface quality and slicing performance were obtained when slicing silicon crystal using the resin-bonded diamond wire saw we made in the experiments.

Info:

Periodical:

Edited by:

Qiusheng Yan, Jiabin Lu, Jun Wang and Hang Gao

Pages:

393-397

DOI:

10.4028/www.scientific.net/AMR.135.393

Citation:

W. B. Bi et al., "Modification of Resin and its Application to Resin-Bonded Diamond Wire Saw Manufacture", Advanced Materials Research, Vol. 135, pp. 393-397, 2010

Online since:

October 2010

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Price:

$35.00

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