Modification of Resin and its Application to Resin-Bonded Diamond Wire Saw Manufacture

Wen Bo Bi; Pei Qi Ge; S.Q. Song; Y.F. Gao; Z.S. Wang; L. Zhang

doi:10.4028/www.scientific.net/AMR.135.393

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Study on Heavy CNC Belt Grinding Technology of High Precision Controllable Pitch Propeller
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 135Modification of Resin and its Application to...

Modification of Resin and its Application to Resin-Bonded Diamond Wire Saw Manufacture

Abstract:

The purpose of this paper is to modify the resin binder for developing resin-bonded diamond wire saw. The optimization of components with different ratios in the resin binder was investigated using orthogonal design experiments. Besides, the resin-bonded diamond wire saw was developed using the piano wire (the diameter is 0.2mm), the modified resin and the diamond abrasive (the diameter is 20~30μm). Good surface quality and slicing performance were obtained when slicing silicon crystal using the resin-bonded diamond wire saw we made in the experiments.

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Periodical:

Advanced Materials Research (Volume 135)

Pages:

393-397

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.135.393

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Online since:

October 2010

Authors:

Wen Bo Bi, Pei Qi Ge, S.Q. Song, Y.F. Gao, Z.S. Wang, L. Zhang

Keywords:

Fixed Abrasive Wire Saw, Orthogonal Design Experiment, Resin Modification

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References

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[5] Y.F. Gao, P.Q. Ge, S.J. Li: J. Synthetic. Cryst. Vol. 2 (2009), p.372 Fig. 5 The abrasive pulled-out Fig. 4 The resin ware Fig. 3 The surface of wire saw Fig. 2 The wire saw section.

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