The Relationship between Residual Stress and Resistivity of Au/NiCr/Ta Multi-Layered Metallic Films by Magnetron Sputtering
Au/NiCr/Ta multi-layered metallic films were deposited on Al2O3 substrate by magnetron sputtering at different substrate temperature. The effect of substrate temperature on magnetron sputtering Au/NiCr/Ta films in crystal orientation, residual stress and resistivity was investigated. The all magnetron sputtering films were highly textured with dominant Au-(111) orientation or a mixture of Au-(111) and Au-(200) orientation. The residual stress in magnetron sputtering films at different substrate temperature was tensile stress with 155MPa-400MPa. A smallest resistivity of 3.6µΩ.cm was obtained for Au/NiCr/Ta multi-layered metallic films at substrate temperature 180°C. The experiment results reveal that the resistivity increased with the increase of the residual stress of metallic films.
Jinglong Bu, Zhengyi Jiang and Sihai Jiao
W. Tang et al., "The Relationship between Residual Stress and Resistivity of Au/NiCr/Ta Multi-Layered Metallic Films by Magnetron Sputtering", Advanced Materials Research, Vols. 150-151, pp. 14-17, 2011