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The Relationship between Residual Stress and Resistivity of Au/NiCr/Ta Multi-Layered Metallic Films by Magnetron Sputtering

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Abstract:

Au/NiCr/Ta multi-layered metallic films were deposited on Al2O3 substrate by magnetron sputtering at different substrate temperature. The effect of substrate temperature on magnetron sputtering Au/NiCr/Ta films in crystal orientation, residual stress and resistivity was investigated. The all magnetron sputtering films were highly textured with dominant Au-(111) orientation or a mixture of Au-(111) and Au-(200) orientation. The residual stress in magnetron sputtering films at different substrate temperature was tensile stress with 155MPa-400MPa. A smallest resistivity of 3.6µΩ.cm was obtained for Au/NiCr/Ta multi-layered metallic films at substrate temperature 180°C. The experiment results reveal that the resistivity increased with the increase of the residual stress of metallic films.

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Periodical:

Advanced Materials Research (Volumes 150-151)

Pages:

14-17

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.150-151.14

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Online since:

October 2010

Authors:

Wu Tang, Xue Hui Wang, Yi Peng Chao, Ke Wei Xu

Keywords:

Au/NiCr/Ta Film, Residual Stress, Resistivity

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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