For Libraries For Publication Open Access Downloads About Us Contact Us
Paper Titles
Development of a New Damping Material with Oil Resistance and High Temperature Resistance
p.1498
Microstructural Evolution and Weldability of AISI 4042 Steel
p.1503
Effect of Hydrogenation on Structural, Optical and Electrical Properties of Amorphous InAsSb Thin Films
p.1508
The Research of by Blend and Flux Method SrFe12O19 Magnetic Particle Preparation and Magnetic Properties
p.1513
Wafer Non-Uniformity Analysis during Chemical Mechanical Polishing Based on Finite Element Method
p.1518
Design of Automatic End-Advanced Hydraulic Support in Coal Face with Deep Dip Angle and Large Mining Height
p.1524
Coupling Capillary Electrophoresis and Ion Mobility Spectrometry via Electrospray Interface: a Preliminary Study
p.1531
Development and Calibration of an Optical Magnetic Twisting Cytometry for Studying Nano-Dynamics of Living Cells
p.1535
Effects of Sputtering Parameters on the Properties of Sputtered ZnO Films
p.1541

Wafer Non-Uniformity Analysis during Chemical Mechanical Polishing Based on Finite Element Method

Article Preview

Abstract:

A contact-mechanics-based finite model for Cu/ low-k chemical mechanical polishing is presented. 2D axisymmetric quasi-static model for chemical mechanical polishing which includes four-layer structure: Si, low-k, Copper and polishing pad is established. The mechanical response at the interface between the silicon, low-k, copper, and pad is simulated under the loading of the chemical mechanical polishing. The effect of slurry is simplified as the friction force reacted onto both the copper and the polishing pad in the finite element model. Down pressure, status of slurry and the elastic modulus of polishing pad are treated as the parameter in the simulation. Using the model, the effects of applied down pressure, pad properties, status of slurry on the non-uniformity of the wafer surface can be readily evaluated. Simulation results show that the distribution of the Von Mises stresses across a wafer’s surface correlates with experimental removal rate profiles.

You might also be interested in these eBooks
Materials Science and Engineering Applications View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 160-162)

Pages:

1518-1523

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.160-162.1518

Citation:

Cite this paper

Online since:

November 2010

Authors:

Shi Wen Du, Yong Tang Li, Jian Jun Song, Hui Ping Qi

Keywords:

Chemical Mechanical Polishing (CMP), Contact Analysis, Non-Uniformity (UN)

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2011 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

References

[1] J.J. vlassak. Journal of the Mechanics and physics of Solids, Vol. 52(2004), p.847.

Google Scholar

[2] Jongwon Seok, Cyriaque P. Sukam, Andrew T. Kim, John A. Tichy and Timothy S. Cale: Wear , Vol. 254(2003), p.307.

DOI: 10.1016/s0043-1648(03)00022-x

Google Scholar

[3] Parshuram B. Zantye, Ashok Kumar and A.K. Sikder: Matericals Science and Engineering R Vol. 45(2004), p.89.

Google Scholar

[4] D. Wang, J. Lee, K. Holland, T. Bibby, S. Beaudoin and T. Cale.:J. Electrochem. Soc, Vol. 144(1997) No. 3, p.1122.

Google Scholar

[5] C. Srinivasa-Murthy,D. Wang, S.P. Beaudoin, T. Bibby, K. Holland andT.S. Cale: Thin Solid Films, Vol. 308(1997), p.533.

DOI: 10.1016/s0040-6090(97)00433-1

Google Scholar

[6] Yeou-Yih Lin and Ship-Peng Lo: Journal of Materials Processing Technology, Vol. 140(2003), p.646.

Google Scholar

© 2025 Trans Tech Publications Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies. For open access content, terms of the Creative Commons licensing CC-BY are applied.
Scientific.Net is a registered trademark of Trans Tech Publications Ltd.