The Simulation of Polycrystalline Silicon Thin Film Deposition in PECVD System

Abstract:

Taking Silicon tetrachloride (SiCl4) and hydrogen (H2) as the reaction gas, by the method of plasma-enhanced chemical vapor deposition (PECVD), this paper simulates the deposition process of polycrystalline silicon thin film on the glass substrates in the software FLUENT. Three dimensional physical model and mathematics model of the simulated area are established. The reaction mechanism including main reaction equation and several side equations is given during the simulation process. The simulation results predict the velocity field, temperature distribution, and concentration profiles in the PECVD reactor. The simulation results show that the deposition rate of silicon distribution is even along the circumference direction, and gradually reduced along the radius direction. The deposition rate is about 0.005kg/(m2•s) at the center. The simulated result is basically consistent with the practical one. It means that numerical simulation method to predict deposition process is feasible and the results are reliable in PECVD system.

• Periodical: Advanced Materials Research (Volumes 189-193)
• Pages: 2032-2036
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.189-193.2032
• Online since: February 2011
• Authors: Zhi Jian Wang, Xiao Feng Shang
• Keywords: Deposition Rate, PECVD, Polycrystalline Silicon Thin Film, Temperature Distribution, Velocity Distribution

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