Study on Intelligent Analysis of the Causes of SMT Solder Joint Defects Based on Fuzzy Neural Network

Chun Yue Huang; He Geng Wei; Tian Ming Li; De Jin Yan

doi:10.4028/www.scientific.net/AMR.189-193.3257

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 189-193Study on Intelligent Analysis of the Causes of SMT...

Study on Intelligent Analysis of the Causes of SMT Solder Joint Defects Based on Fuzzy Neural Network

Abstract:

By determining membership function of the input parameters and selecting defuzzification method, the evaluation model which can be used to intelligent analyzing the causes of SMT solder joint defects was set up. The fuzzy neural network was trained by using the output variables of the training samples from intelligent discrimination as the input variables of training samples of fuzzy neural network. The fuzzy neural network was tested by using the output variables of the testing samples from intelligent discrimination as the input variables of testing samples of fuzzy neural network. The results show that by using the evaluation model the cause of SMT solder joint defects can be analyzed intelligently and the results of intelligently analysis are reasonable, the evaluation model can be used practically.

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Periodical:

Advanced Materials Research (Volumes 189-193)

Pages:

3257-3261

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.189-193.3257

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Online since:

February 2011

Authors:

Chun Yue Huang, He Geng Wei, Tian Ming Li, De Jin Yan

Keywords:

Fuzzy Neural Network (FNN), Intelligent Detecting, Solder Joint Defect, Surface Mount Technology (SMT)

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References

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