Resistance Microwelding of Au/Ni-Plated Phosphor Bronze Sheet to Insulated Cu Wire
Resistance microwelding of Au/Ni-plated phosphor bronze sheet to insulated Cu wire have been investigated using mechanical testing, optical microscopy, scanning electron microscopy, and energy-dispersive X-ray spectroscopy. The results show that mechanisms of joint formation involve solid-state bonding with Au and Cu atoms diffusion at low welding current, a combination of brazing and solid-state bonding at high welding current. Due to the hindrance of Ni plating which has a higher melting temperature and hardness, the joint breaking force is smaller than that without plating.
Zhengyi Jiang, Shanqing Li, Jianmin Zeng, Xiaoping Liao and Daoguo Yang
B. H. Mo et al., "Resistance Microwelding of Au/Ni-Plated Phosphor Bronze Sheet to Insulated Cu Wire", Advanced Materials Research, Vols. 189-193, pp. 3596-3600, 2011