Resistance Microwelding of Au/Ni-Plated Phosphor Bronze Sheet to Insulated Cu Wire

Abstract:

Resistance microwelding of Au/Ni-plated phosphor bronze sheet to insulated Cu wire have been investigated using mechanical testing, optical microscopy, scanning electron microscopy, and energy-dispersive X-ray spectroscopy. The results show that mechanisms of joint formation involve solid-state bonding with Au and Cu atoms diffusion at low welding current, a combination of brazing and solid-state bonding at high welding current. Due to the hindrance of Ni plating which has a higher melting temperature and hardness, the joint breaking force is smaller than that without plating.

• Periodical: Advanced Materials Research (Volumes 189-193)
• Pages: 3596-3600
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.189-193.3596
• Online since: February 2011
• Authors: Bing Hua Mo, Zhong Ning Guo, Yuan Bo Li, Guan Wang
• Keywords: Au/Ni Plating, Brazing, Insulated Cu Wire, Resistance Microwelding, Solid-State Bonding

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