Analyses of Interfacial Thermal Stresses for DLC/WC-Co

Abstract:

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Thermal expansion mismatch is the most important which leads to the film/substrate interface damage and destruction. In this paper, the interface stresses analyses was conducted using Airy functions for the diamond-like carbon (DLC) film/ tungsten cobalt alloy(WC-Co) substrate structure; according to stress-strain relation, obtain the interface stress expression by substituting into the boundary conditions for giving parameter. The calculation results were analyzed and compared with the FEM simulation.

Info:

Periodical:

Advanced Materials Research (Volumes 189-193)

Edited by:

Zhengyi Jiang, Shanqing Li, Jianmin Zeng, Xiaoping Liao and Daoguo Yang

Pages:

3870-3873

DOI:

10.4028/www.scientific.net/AMR.189-193.3870

Citation:

J. Zhang et al., "Analyses of Interfacial Thermal Stresses for DLC/WC-Co", Advanced Materials Research, Vols. 189-193, pp. 3870-3873, 2011

Online since:

February 2011

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Price:

$35.00

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