Analyses of Interfacial Thermal Stresses for DLC/WC-Co
Thermal expansion mismatch is the most important which leads to the film/substrate interface damage and destruction. In this paper, the interface stresses analyses was conducted using Airy functions for the diamond-like carbon (DLC) film/ tungsten cobalt alloy(WC-Co) substrate structure; according to stress-strain relation, obtain the interface stress expression by substituting into the boundary conditions for giving parameter. The calculation results were analyzed and compared with the FEM simulation.
Zhengyi Jiang, Shanqing Li, Jianmin Zeng, Xiaoping Liao and Daoguo Yang
J. Zhang et al., "Analyses of Interfacial Thermal Stresses for DLC/WC-Co", Advanced Materials Research, Vols. 189-193, pp. 3870-3873, 2011