Analyses of Interfacial Thermal Stresses for DLC/WC-Co

Abstract:

Thermal expansion mismatch is the most important which leads to the film/substrate interface damage and destruction. In this paper, the interface stresses analyses was conducted using Airy functions for the diamond-like carbon (DLC) film/ tungsten cobalt alloy(WC-Co) substrate structure; according to stress-strain relation, obtain the interface stress expression by substituting into the boundary conditions for giving parameter. The calculation results were analyzed and compared with the FEM simulation.

• Periodical: Advanced Materials Research (Volumes 189-193)
• Pages: 3870-3873
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.189-193.3870
• Online since: February 2011
• Authors: Jun Zhang, Yang Li, Xin Li Wei
• Keywords: Diamond-Like Carbon (DLC), Interfacial Stress, Thermal Loading

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