Adhesion and Electrical Properties of Copper Nitride Films

Jian Rong Xiao; Ai Hua Jiang

doi:10.4028/www.scientific.net/AMR.197-198.344

Paper Titles

Studies on BaO-CeO₂-TiO₂ Microwave Dielectric Ceramics
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A Novel Ceramic Thermocouple Used in High-Temperature Measurement
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The Effect of B₂O₃–Li₂CO₃ Addition on Sintering Behavior and Dielectric Properties of Ba_0.6Sr_0.4TiO₃ Ceramics
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A Self-Adaptive Fan Clutch for Automobile
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Adhesion and Electrical Properties of Copper Nitride Films
p.344

Preparation of N Doped ZnO Films by Magnetron Sputtering
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Influence of Random Disorders on Anti-Plane Waveguiding Modes in a Two-Dimensional Phononic Crystal
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The Surface Morphology and Mechanical Behavior Studies of DAST Crystal on (001) and (110) Faces
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Preparation and Stabilization of High Conductivity Zn-Coated Tetra-Needle-Like ZnO Whiskers
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 197-198Adhesion and Electrical Properties of Copper...

Adhesion and Electrical Properties of Copper Nitride Films

Abstract:

Copper nitride films were prepared by reactive magnetron sputtering on glass sheets at different deposition conditions. The surface morphology of the films was evaluated by a scanning electron microscope (SEM). The SEM images demonstrate that the films have a compact structure. The structure of the films was characterized by X-ray diffraction (XRD). We focused on the influence of preparation parameters on the adhesion and electrical properties of the films. The metallurgical microscope results indicate that the adhesion of the films enhances with increasing deposition power. The current-voltage (I-V) measurement results show that the resistivity of the films increases with the increasing lattice constants.