Effect of Surface Relaxation on Characteristics of Nanomachined Surface

Article Preview

Abstract:

With the development of Micro-electro-mechanical systems (MEMS) and Nano-electro-mechanical systems (NEMS), dimension of their parts is required to nanometer scale, and the characteristics of machined-surface of nano-scale parts affect strongly its application. Surface relaxation plays an important role to the characteristics of the machined-surface. In this paper, machined-surface of monocrystal copper used as the specimen of surface relaxation, and its surface relaxation process is simulated. The influences of surface relaxation on surface energy, atom array, surface roughness, surfaces hardness and surface residual stress of the monocrystal copper are analyzed. Results show that surface energy and surface hardness decrease due to relaxation; work-hardening can’t be completely eliminated by the relaxation; compression residual stress of the machined surface is changed gradually to tensile stress during the relaxation. These research results are very helpful to the application of nano-machined parts.

You might also be interested in these eBooks

Info:

Periodical:

Advanced Materials Research (Volumes 211-212)

Pages:

742-746

Citation:

Online since:

February 2011

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2011 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] X. S. Han, Y. Z. Hu, S. Yu, EPJ Applied Physics 42, 255(2008).

Google Scholar

[2] Jiachun Wang, Jimin Zhang, F enghe Wu, Na Li, Advanced Materials Research 60-61, 435(2009).

Google Scholar

[3] Y. B. Guo, Y. C. Liang, M.J. Chen, L H Lu, Acta Metall Sin 45, 1199(2009).

Google Scholar

[4] Y. C. Liang, H. M. Pan, Q. S. Bai, Acta Metall Sin 45, 1205(2009).

Google Scholar

[5] Y. C. Liang, Y B Guo, M J Chen, Q S Bai, Molecular dynamics simulation of heat distribution during nanometric cutting process, 2nd IEEE International Nanoelectronics Conference, (2008) March 24 – 27; Shanhai, China.

DOI: 10.1109/inec.2008.4585584

Google Scholar

[6] Y.C. Liang, J.X. Chen, Q.S. Bai, Y.L. Tang and M.J. Chen, Acta Metall Sin 44, 119(2009).

Google Scholar

[7] Y. L . Tang, Y. C. Liang, X. D. Liu, J. H. Dou, D. X. Wang, Key Eng Mater 315-316, 370(2006).

Google Scholar

[8] M. N. Magomedov, Phys Solid State 46, 954(2004).

Google Scholar

[9] B. J. Lee, J. H. Shim, M. I. Bakes, Phys Rev B: Condens Matter 68, 144112(2003).

Google Scholar

[10] V. P. Bokarev, Crystallogr Rep 45, 515(2000).

Google Scholar

[11] H. L. Striver, N. M. Rosengaard, Phys Rev B: Condens Matter 46, 7157(1992).

Google Scholar

[12] L. Kornblit, A. Ignatiev, Phys A 141, 466(1987).

Google Scholar

[13] M. T. Lilburne, J Mater Sci 5, 351(1970).

Google Scholar

[14] D. Huo, Y. Liang, K. Cheng, Journal of Harbin Institute of Technology 4, 408(2003).

Google Scholar

[15] D. J . Wang, Editor, Mechanical Performance of Metal. Harbin Industry Press, Harbin(1993).

Google Scholar