Control System Research of 2-DOF Precision Positioning Table for IC Packaging

Abstract:

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In order to improve the precision and efficiency of IC packaging for wafer wire bonding equipment, a new 2-DOF positioning table of high speed and accuracy, directly driven by voice coil actuator, is put forward. By establishing dynamic model of VCA and positioning table, the electromechanical coupling control system based on minimum deadbeat response controlling algorithm is proposed. The prototype experiment shows that the new 2-DOF positioning table is robust and of good dynamic performance.

Info:

Periodical:

Advanced Materials Research (Volumes 211-212)

Edited by:

Ran Chen

Pages:

761-765

DOI:

10.4028/www.scientific.net/AMR.211-212.761

Citation:

X. M. Feng et al., "Control System Research of 2-DOF Precision Positioning Table for IC Packaging", Advanced Materials Research, Vols. 211-212, pp. 761-765, 2011

Online since:

February 2011

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Price:

$35.00

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