Control System Research of 2-DOF Precision Positioning Table for IC Packaging
In order to improve the precision and efficiency of IC packaging for wafer wire bonding equipment, a new 2-DOF positioning table of high speed and accuracy, directly driven by voice coil actuator, is put forward. By establishing dynamic model of VCA and positioning table, the electromechanical coupling control system based on minimum deadbeat response controlling algorithm is proposed. The prototype experiment shows that the new 2-DOF positioning table is robust and of good dynamic performance.
X. M. Feng et al., "Control System Research of 2-DOF Precision Positioning Table for IC Packaging", Advanced Materials Research, Vols. 211-212, pp. 761-765, 2011