Preparation of Hexaphenylamine Cyclotriphosphazene and its Green Flame Retardance on Epoxy Molding Compound for Large-Scale Integrated Circuit Packaging

Ming Shan Yang; Lin Kai Li

doi:10.4028/www.scientific.net/AMR.239-242.1386

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 239-242Preparation of Hexaphenylamine Cyclotriphosphazene...

Preparation of Hexaphenylamine Cyclotriphosphazene and its Green Flame Retardance on Epoxy Molding Compound for Large-Scale Integrated Circuit Packaging

Abstract:

The hexaphenylamine cyclotriphosphazene (HPACTPZ) was synthesized using titrating technology of hexachlorocyclotriphosphazene solution and the synthesis parameters were investigated, and the structure of HPACTPZ was analyzed by FTIR and NMR in this paper. Using HPACTPZ synthesized in the work as flame retardant, the epoxy molding compound(EMC) for packaging of large-scale integrated circuits with halogen-free flame retardance was prepared. The results have shown that the flame retardance of EMC flame-retardanced by HPACTPZ was up to UL 94 V0 rating(3.2mm) and the oxygen index of the EMC was up to 35.8%, which indicates that HPACTPZ has much better flame retardance for EMC than traditional halogen flame-retardants. Meanwhile, HPACTPZ accelerated the curing reaction rate of EMC, which can be used for manufacturing the quick-curing EMCs or afterward-curing-free EMCs.

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Periodical:

Advanced Materials Research (Volumes 239-242)

Pages:

1386-1390

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.239-242.1386

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Online since:

May 2011

Authors:

Ming Shan Yang, Lin Kai Li

Keywords:

Environmentally Friendship Retardance, Epoxy Molding Compound, Hexaphenylamine Cyclotriphosphazene, Large-Scale Integrated Circuit Packaging

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References

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