Study of Brazeability of SiCP/A356 Composites and Aluminum Alloy Using Semisolid Metal with High Solid Fraction by Stirring

Article Preview

Abstract:

The semi-solid brazing process of SiCp/A356 composites and 2024 aluminum alloy using Zn-Al eutectic filler metal at 450 °C has been investigated. The two substrates and Zn-Al filler metal were heated up to the semisolid temperature range of Zn-Al filler metal by a resistance heating plate. In order to mix the filler metal with the base metal of both sides to be a single uniform joint, a stirrer was introduced into the weld seam. After stirring, specimens were sectioned for analysis of macro- and micro-structures along the weld region. The research shows that SiCp/A356 composites and aluminum can be joining by semisolid metal. It can be found that almost half of the oxide film on the surface of the base metal was disrupted and removed through the observation by SEM. The metallurgical bonds formed between the filler metal and the base materials on the interface of oxide had been disrupted. Moreover, the oxide film of surface of aluminum alloy was more thoroughly disrupted and removed than that of surface of composites with existing of SiC particle.

You might also be interested in these eBooks

Info:

Periodical:

Advanced Materials Research (Volumes 239-242)

Pages:

663-666

Citation:

Online since:

May 2011

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2011 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] Sun DQ, Gu XY and Liu WH: Mater. Sci. Eng A. Vol. 391(2005), p.29

Google Scholar

[2] Huang, JH, Wan Y, Zhao HT, Cheng DH and Zhang H: Mater. Sci. Technol. Vol. 23 (2007), p.87

Google Scholar

[3] Liu LM, Zhu ML, Pan LX and Wu L: Mater. Sci. Eng A. Vol. 315 (2001), p.103

Google Scholar

[4] Zhang XP, Ye L, Mai YW: Compos Part A: Appl Sci Manuf. Vol.30(1999), p.1415

Google Scholar

[5] Zhang XP, Quan GF, Wei W: Compos Part A: Appl Sci Manuf. Vol. 30(1999), p.823

Google Scholar

[6] Urena A, Gil L, Escriche E: Sci. Tech. Weld. Join. Vol. 6(2001), p.1

Google Scholar

[7] J.HU, Q.F. XING, C.K. YAO. J. MATER. SCI. LETTERS, Vol. 16(1997),p.835

Google Scholar

[8] J. C. Yan, H. B. Xu, L. Shi, X. L. Wang, S. Q. Yang. Sci. Technol.Weld. Join. Vol. 13(2008),p.760

Google Scholar

[9] Mendez PF, Rice CS and Brown SB: Weld. J. Vol. 81(2002), p.181

Google Scholar

[10] Shalchi B, Aashuri H, Kokabi A, Abbasi Gharacheh M and Molla J: Solid State Phenomena. Vol. 116-117 (2006), p.397

DOI: 10.4028/www.scientific.net/ssp.116-117.397

Google Scholar

[11] Narimannezhad A, Aashuri H, Kokabi A and Khosravani A: J. Mater. Proc. Technol. Vol. 209(2009), p.4112

Google Scholar

[12] Kiuchi M, Kopp R.. CIRP Ann. Manuf. Technol. Vol. 51(2002),p.653

Google Scholar