Study on Effect of Composite Particles in Polishing Process and Its Mechanism

Abstract:

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In this paper, mixed slurries containing silica abrasives and polystyrene (PS) polymer particles in deionized water at pH 10.5 have been evaluated for silicon wafer polishing. By applying the theory of electric double layer model, the effect of the particle interactions in mixed slurry is investigated. Zeta potential measurements and TEM images have been used to show the formation of composite particles. The polishing mechanism with composite particles slurries is discussed. Polishing experiments with the mixed slurries formed by coating smaller (~30nm) abrasives onto softer and larger (~2000nm) polymer particles have shown the superior characteristic with higher removal rate and high surface quality.

Info:

Periodical:

Advanced Materials Research (Volumes 24-25)

Edited by:

Hang Gao, Zhuji Jin and Yannian Rui

Pages:

155-159

DOI:

10.4028/www.scientific.net/AMR.24-25.155

Citation:

X. F. Xu et al., "Study on Effect of Composite Particles in Polishing Process and Its Mechanism", Advanced Materials Research, Vols. 24-25, pp. 155-159, 2007

Online since:

September 2007

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Price:

$35.00

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