Study on Effect of Composite Particles in Polishing Process and Its Mechanism

Xue Feng Xu; B.X. Ma; Feng Chen; Wei Peng

doi:10.4028/www.scientific.net/AMR.24-25.155

Paper Titles

Study on the Characteristics of Simply Mixed the Magnetic Abrasives Particles
p.133

EDM with USM Combination Process of Sintered NdFeB Permanent Magnet
p.139

A New Method of Reducing Shock between Press Head and Press Disk in High Speed Lapping
p.145

Study on Building and Simulation of the Polishing Path of Mold Based on MasterCAM
p.149

Study on Effect of Composite Particles in Polishing Process and Its Mechanism
p.155

Study on Contact Pressure between Grain and Workpiece during Floating Polishing
p.161

Computer Emulation to the Tool Head of the Ultrasonic Vibration Machine for Honing
p.165

Precision Grinding of High Chromium Steels Using Metal Bonded CBN Wheel
p.171

Experimental Study on Cryogenic Polishing Single Silicon Wafer with Nano-Sized Cerium Dioxide Powders
p.177

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Study on Effect of Composite Particles in Polishing Process and Its Mechanism

Abstract:

In this paper, mixed slurries containing silica abrasives and polystyrene (PS) polymer particles in deionized water at pH 10.5 have been evaluated for silicon wafer polishing. By applying the theory of electric double layer model, the effect of the particle interactions in mixed slurry is investigated. Zeta potential measurements and TEM images have been used to show the formation of composite particles. The polishing mechanism with composite particles slurries is discussed. Polishing experiments with the mixed slurries formed by coating smaller (~30nm) abrasives onto softer and larger (~2000nm) polymer particles have shown the superior characteristic with higher removal rate and high surface quality.