ECCI Observation of Dislocation Structure Formed around an Intergranular Fatigue Crack in Copper

Abstract:

A fatigue crack growth test was conducted in a polycrystalline copper. Dislocation structure formed near an intergranular fatigue crack was investigated by electron channelling contrast imaging (ECCI) method. The ECCI method enables us to observe dislocations lying under surface using a scanning electron microscope. The fatigue crack in the copper specimen was grown along both grain boundaries and slip bands inside grain. The ECCI observations revealed that both the vein dislocation structure and the cell structures were formed near the grain boundaries. The formations of different dislocation structures near boundaries could be interpreted in terms of the plastic strain incompatibility.

• Periodical: Advanced Materials Research (Volumes 26-28)
• Pages: 1317-1320
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.26-28.1317
• Online since: October 2007
• Authors: Yoshihisa Kaneko, M. Ishikawa, Satoshi Hashimoto
• Keywords: Copper (Cu), Crack, Dislocation Structure, ECCI Method, Fatigue, Grain Boundary, Plastic Incompatibility

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